Information-processing device having a crossbar-board connected to back panels on different sides

ABSTRACT

An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention generally relates to an informationprocessing device and, more particularly, to a multiprocessorincorporated in a server.

[0003] Recently, as the Internet has rapidly become prevalent, theelectronic commerce is undergoing a rapid expansion. In the electroniccommerce, one has to exchange information with many and unspecifiedpeople or businesses, and has to process such information, necessitatinga server capable of processing information at high speed. Such a serveris required to be highly reliable, and further, to be as small aspossible.

[0004] Such a server comprises a multiprocessor. Therefore, such amultiprocessor is required to be capable of processing information athigh speed, to be highly reliable, and further, to be as small aspossible.

[0005] One type of such a multiprocessor is an SMP (SymmetricMultiprocessor) wherein all of its CPUs share all of its memories andeach of the CPUs accesses each of the memories at the same speed.

[0006] The SMP is further classified into a bus type and acrossbar-interconnect type. The bus type is a system wherein all of itsCPUs share a single bus. The crossbar-interconnect type is a systemwherein all of its CPUs are crossbar-connected to all of its memories,enabling a plurality of the CPUs to simultaneously access differentmemories. Thus, the crossbar-interconnect type has a better accessproperty than the bus type.

[0007] 2. Description of the Related Art

[0008]FIG. 1 is an illustration of a conventional multiprocessor 10 ofthe crossbar-interconnect type.

[0009] In general, a multiprocessor basically comprises: a backboard; aplurality of crossbar-boards connected to a backside thereof byconnectors; and a plurality of motherboards plugged in and connected toa front of the backboard by the connectors. Since a backboard is limitedin size due to reasons deriving from a manufacturing process thereof,the maximum number of motherboards connected to the backboard is eight,for example.

[0010] The above-mentioned multiprocessor 10 is capable of processingnumerous information, and thus requires 16 motherboards, for example.Therefore, the multiprocessor 10 comprises two units 11 and 21 eachhaving a backboard proper in size, the two units 11 and 21 beingconnected to each other by a multitude of cables 30.

[0011] The unit 11 comprises: a backboard 12; a plurality ofcrossbar-boards 13 connected to a backside thereof by connectors; andeight motherboards 14 plugged in and connected to a front of thebackboard 12 by the connectors. The unit 21, in the same manner as theunit 11, comprises: a backboard 22; a plurality of crossbar-boards 23connected to a backside thereof by connectors; and eight motherboards 24plugged in and connected to a front of the backboard 22 by theconnectors. Each of the motherboards 14 and 24 comprises: a board; and aCPU 15 and a memory module 16 each mounted thereon. Each of theplurality of crossbar-boards 13 and 23 comprises a board and a switchingcircuit 17 mounted thereon.

[0012] The plurality of crossbar-boards 13 of the unit 11 and theplurality of crossbar-boards 23 of the unit 21 are connected by themultitude of cables 30.

[0013] The CPUs 15 of the motherboards 14 of the unit 11 are connectedto one another by wiring patterns on the crossbar-boards 13. Therefore,a transmission distance of signals between any two of the motherboards14 is short. However, the CPUs 15 of the motherboards 14 of the unit 11are connected to the CPUs 15 of the motherboards 24 of the unit 21 bythe wiring patterns on the crossbar-boards 13, the cables 30 and wiringpatterns on the crossbar-boards 23. Therefore, a transmission distanceof signals between any one of the motherboards 14 and any one of themotherboards 24 is long, increasing the likelihood of causing distortionof transmitting signals. The distortion of transmitting signals occursas an error when raising a transfer rate of signals. Therefore, thetransfer rate of signals could not be raised, rather has to be kept lowto avoid causing the distortion of transmitting signals. In this way,the multiprocessor 10 has a hindering problem in processing informationat high speed.

[0014] Additionally, as described above, the multiprocessor 10 comprisesthe two units 11 and 21 connected to each other by the multitude ofcables 30. Thus, manufacturing the multiprocessor 10 requires steps ofconnecting the multitude of cables 30 one by one. These steps ofconnecting are not only cumbersome but also prone to error. Further,when even a single cable of the multitude of cables 30 causes a poorconnection, the multiprocessor 10 cannot operate normally. Theserespects arouse another problem in reliability.

[0015] Besides, as described above, the multiprocessor 10 comprises thetwo units 11 and 21 connected to each other by the cables 30, the cablesincreasing the size of the multiprocessor 10. This is a problem ofinevitably increasing the size of a server comprising the multiprocessor10.

SUMMARY OF THE INVENTION

[0016] It is a general object of the present invention to provide animproved and useful information processing device in which device theabove-mentioned problems are eliminated.

[0017] A more specific object of the present invention is to provide aninformation processing device which can process information at highspeed, with a reduced size and increased reliability.

[0018] In order to achieve the above-mentioned objects, there isprovided according to one aspect of the present invention aninformation-processing device comprising:

[0019] at least one crossbar-board having a switching element mountedthereon;

[0020] a plurality of back panels detachably connected electrically andmechanically to different sides of the crossbar-board; and

[0021] at least one motherboard detachably connected electrically andmechanically to each of the back panels, the motherboard having aninformation-processing semiconductor element mounted thereon.

[0022] Additionally, in the information-processing device according tothe present invention, the crossbar-board may be arranged perpendicularto a surface of each of the back panels. Also, the motherboard may bearranged crosswise to the crossbar-board. Further, the back panels maybe connected to the different sides of the crossbar-board by connectors.Likewise, the motherboard may be connected to each of the back panels byconnectors.

[0023] According to the present invention, since theinformation-processing device does not comprise the cables, transmissiondistances of signals in the information-processing device become shortby the length of the cables, reducing the likelihood of causingdistortion of the transmitting signals. Thereby, a conventionallimitation restricting a transfer rate of signals is eased, andaccordingly, the transfer rate of the signals can be raised higher thana conventional information-processing device. In this way, theinformation-processing device according to the present invention canprocess information at a higher speed than a conventionalinformation-processing device. Additionally, also since theinformation-processing device according to the present invention doesnot use the cables, the information-processing device can have a smallstructure in size. Further, since the information-processing deviceaccording to the present invention does not suffer a malfunction due toa poor connection of the cables, the information-processing device ismore reliable than a conventional information-processing device.

[0024] In order to achieve the above-mentioned objects, there isprovided according to another aspect of the present invention aninformation-processing device comprising:

[0025] a crossbar board-back panel assembly comprising a plurality ofcrossbar-boards each having a switching element mounted thereon, and aplurality of back panels detachably connected electrically andmechanically to different sides of each of the crossbar-boards; and

[0026] a plurality of motherboards detachably connected electrically andmechanically to each of the back panels, each of the motherboards havingan information-processing semiconductor element mounted thereon.

[0027] According to the present invention, the information-processingdevice can process information at a higher speed than a conventionalinformation-processing device. Additionally, the information-processingdevice according to the present invention can have a small structure insize. Further, the information-processing device is more reliable than aconventional information-processing device.

[0028] Additionally, in the information-processing device according tothe present invention, the crossbar-board further comprises wiringpatterns connecting the switching element and the connectors, the wiringpatterns being formed to have an equal length.

[0029] According to the present invention, transmission distances ofsignals between the motherboards are always the same, achieving anoptimal SMP if the information-processing device is a multiprocessor.

[0030] Additionally, in the information-processing device according tothe present invention, the crossbar-board may have a rectangular shape,and the back panels may be connected to longitudinal sides of thecrossbar-board, the back panels opposing each other.

[0031] According to the present invention, the information-processingdevice can have a small structure in size.

[0032] Additionally, in the information-processing device according tothe present invention, the crossbar-board may further compriseconnectors connecting the longitudinal sides of the crossbar-board tothe back panels, each of the connectors having a connecting faceparallel to a surface of the crossbar-board, and

[0033] the back panels may further comprise connectors respectivelyconnecting the back panels to the longitudinal sides of thecrossbar-board, each of the connectors having a connecting faceperpendicular to a surface of each of the back panels,

[0034] wherein the crossbar-board is movable in a directionperpendicular to the surface thereof so as to connect the connectorsthereof to the connectors of the back panels.

[0035] According to the present invention, the crossbar-board can bereplaced without disassembling the crossbar-board back panel assembly,enhancing a maintainability of the information-processing device.

[0036] Additionally, in the information-processing device according tothe present invention, the crossbar-board may further comprise at leastone extension crossbar-board connected at an end of the crossbar-boardin a longitudinal direction.

[0037] According to the present invention, connecting the extensioncrossbar-board to the crossbar-board can provide an extra-longcrossbar-board without using special facilities.

[0038] Additionally, in the information-processing device according tothe present invention, the crossbar-board may have a polygonal shape,and the back panels may be connected to the different sides of thecrossbar-board, the back panels being more than two.

[0039] According to the present invention, a number of the motherboardscan be increased with maintaining a small structure, enhancing acapacity of the information-processing device to process information.

[0040] Additionally, in the information-processing device according tothe present invention, each of the back panels may be formed by aplurality of strip panels arranged at positions corresponding to themotherboards, the strip panels crossing the crossbar-boards.

[0041] According to the present invention, each of the strip panels canbe connected to the crossbar-boards smoothly. Consequently, theinformation-processing device can also be assembled smoothly.

[0042] Additionally, in the information-processing device according tothe present invention, each of the back panels may be formed by aplurality of strip panels arranged at positions corresponding to thecrossbar-boards, the motherboards crossing the strip panels.

[0043] According to the present invention, since each of the strippanels can be connected to the crossbar-boards smoothly, theinformation-processing device can also be assembled smoothly.

[0044] In order to achieve the above-mentioned objects, there isprovided according to another aspect of the present invention a methodof manufacturing a crossbar board-back panel assembly of aninformation-processing device comprising: the crossbar board-back panelassembly comprising a plurality of crossbar-boards arranged in parallel,and a plurality of back panels detachably connected electrically andmechanically to different sides of each of the crossbar-boards; and aplurality of motherboards detachably connected electrically andmechanically to each of the back panels, each of the motherboards havingan information-processing semiconductor element mounted thereon, themethod comprising the steps of:

[0045] holding each of the back panels while allowing the held backpanel to move slightly in directions parallel to a surface thereof; and

[0046] pressing the held back panel to one of the different sides ofeach of the crossbar-boards so that the held back panel is connected tothe one of the different sides of each of the crossbar-boards.

[0047] According to the present invention, since each of the back panelsare held while being allowed to move slightly in directions parallel toa surface thereof, connectors on the held back panel are smoothlyconnected to connectors on the different sides of the crossbar-boards.Therefore, the information-processing device can also be assembledsmoothly.

[0048] Additionally, in the information-processing device according tothe present invention, the strip panels may be supplied with differentvoltages.

[0049] According to the present invention, each of the motherboards caneasily be supplied with different voltages.

[0050] In order to achieve the above-mentioned objects, there isprovided according to another aspect of the present invention aninformation-processing device comprising:

[0051] a crossbar board-back panel assembly comprising a plurality ofrectangular crossbar-boards arranged in parallel, and two opposing backpanels detachably connected electrically and mechanically tolongitudinal sides of each of the crossbar-boards; and

[0052] a plurality of motherboards detachably connected electrically andmechanically to each of the two opposing back panels, each of themotherboards having an information-processing semiconductor elementmounted thereon,

[0053] wherein the two opposing back panels are formed by a plurality ofpairs of two opposing strip panels arranged at positions correspondingto each of the rectangular crossbar-boards, and

[0054] the crossbar board-back panel assembly includes a plurality ofcrossbar board-strip panel assemblies piled up on each other, each ofthe crossbar board-strip panel assemblies comprising one of therectangular crossbar-boards, and one of the pairs of the two opposingstrip panels detachably connected electrically and mechanically to thelongitudinal sides of the one of the rectangular crossbar-boards.

[0055] According to the present invention, the crossbar board-back panelassembly can be easily assembled by piling up a plurality of thecrossbar board-strip panel assemblies on each other.

[0056] Additionally, in the information-processing device according tothe present invention, the crossbar board-back panel assembly mayfurther comprise a guide pole arranged upright so that the crossbarboard-strip panel assemblies are piled up on each other with a holeformed in each of the rectangular crossbar-boards being passed throughby the guide pole, and

[0057] the crossbar board-strip panel assemblies are supplied with avoltage via the guide poles.

[0058] According to the present invention, the crossbar board-back panelassembly can be achieved that has a sustainable structure and can easilysupply a voltage to the crossbar-boards and the strip panels.

[0059] Additionally, in the information-processing device according tothe present invention, the crossbar board-back panel assembly mayfurther comprise guide rails arranged horizontally so that the crossbarboard-strip panel assemblies are piled up on each other with upper andunder edges of each of the pairs of the two opposing strip panels beinginserted into the guide rails, and

[0060] the crossbar board-strip panel assemblies are supplied with avoltage via the guide rails.

[0061] According to the present invention, the crossbar board-back panelassembly can be achieved that has a sustainable structure and can easilysupply a voltage to the crossbar-boards and the strip panels.

[0062] Additionally, the information-processing device according to thepresent invention may further comprise hollow heat-radiation componentseach placed between the crossbar-boards, wherein an air moves throughinside of the hollow heat-radiation components.

[0063] According to the present invention, the information-processingdevice can be efficiently forced-air cooled.

[0064] Additionally, in the information-processing device according tothe present invention, each of the back panels may comprise a grid-likeframe and smaller panels than each of the back panels, the smallerpanels arranged in the grid-like frame.

[0065] According to the present invention, the back panels can be easilyenlarged.

[0066] Additionally, in the information-processing device according tothe present invention, the smaller panels may be supplied with a voltagevia the grid-like frame.

[0067] According to the present invention, the smaller panels can easilybe supplied with a voltage.

[0068] Additionally, in the information-processing device according tothe present invention, each of the back panels may comprise smallerpanels than each of the back panels, the smaller panels detachablyconnected electrically and mechanically to each other.

[0069] According to the present invention, the smaller panels can easilybe supplied with a voltage.

[0070] In order to achieve the above-mentioned objects, there is alsoprovided according to another aspect of the present invention aninformation-processing device comprising:

[0071] two grid-like frames opposing each other;

[0072] a plurality of crossbar-boards fixed between the two grid-likeframes;

[0073] at least one motherboard fixed to each of the two grid-likeframes, the motherboard having an information-processing semiconductorelement mounted thereon; and

[0074] a flexible connector connecting the motherboard and each of thecrossbar-boards.

[0075] According to the present invention, since an air moves throughthe grid-like frames, the motherboard and the crossbar-boards can beefficiently forced-air cooled. In addition, since theinformation-processing device uses the flexible connector, thecrossbar-boards can maintain a symmetrical effect of the equal-lengthwiring patterns thereof.

[0076] In order to achieve the above-mentioned objects, there is alsoprovided according to another aspect of the present invention aninformation-processing device comprising:

[0077] a crossbar board-back panel assembly comprising a plurality ofcrossbar-boards arranged in parallel, and a plurality of back panelsdetachably connected electrically and mechanically to different sides ofeach of the crossbar-boards; and

[0078] a plurality of motherboards detachably connected electrically andmechanically to each of the back panels, each of the motherboards havingan information-processing semiconductor element mounted thereon,

[0079] wherein the crossbar board-back panel assembly includes a casterprovided on the bottom thereof.

[0080] According to the present invention, the crossbar board-back panelassembly can be moved easily on the caster.

[0081] In order to achieve the above-mentioned objects, there is alsoprovided according to another aspect of the present invention a servercomprising:

[0082] a body having a room to contain a crossbar board-back panelassembly comprising a plurality of crossbar-boards arranged in parallel,and a plurality of back panels detachably connected electrically andmechanically to different sides of each of the crossbar-boards; and

[0083] the crossbar board-back panel assembly including a casterprovided on the bottom thereof, the crossbar board-back panel assemblybeing contained in the room.

[0084] According to the present invention, the crossbar board-back panelassembly can be easily set to the server, and also can be easily removedfrom the server, enhancing a maintainability of the server.

[0085] Other objects, features and advantages of the present inventionwill become more apparent from the following detailed description whenread in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0086]FIG. 1 is an illustration of a conventional multiprocessor of acrossbar-interconnect type;

[0087]FIG. 2 is an illustration of a multiprocessor according to a firstembodiment of the present invention;

[0088]FIG. 3 is a plan view of the multiprocessor shown in FIG. 2;

[0089]FIG. 4 is an illustration of a structure of a first back panelshown in FIG. 2;

[0090]FIG. 5 is an illustration of a variation of the first back panelshown in FIG. 4;

[0091]FIG. 6 is an illustration of a variation of a crossbar-board ofthe multiprocessor shown in FIG. 3;

[0092]FIG. 7 is an illustration of a multiprocessor according to asecond embodiment of the present invention;

[0093]FIG. 8 is an illustration of a multiprocessor according to a thirdembodiment of the present invention;

[0094]FIG. 9 is an illustration of a multiprocessor according to afourth embodiment of the present invention;

[0095]FIG. 10 is an illustration of a multiprocessor according to afifth embodiment of the present invention;

[0096]FIG. 11 is a side view of the multiprocessor shown in FIG. 10;

[0097]FIG. 12 is an illustration of a multiprocessor according to asixth embodiment of the present invention;

[0098]FIG. 13 is an illustration of a multiprocessor according to aseventh embodiment of the present invention;

[0099]FIG. 14 is an illustration of a multiprocessor according to aneighth embodiment of the present invention;

[0100]FIG. 15 is a magnified illustration of a connecting part of anextension crossbar-board and a crossbar-board shown in FIG. 14;

[0101]FIG. 16 is an illustration of a multiprocessor according to aninth embodiment of the present invention;

[0102]FIG. 17 is an illustration of a multiprocessor according to atenth embodiment of the present invention;

[0103]FIG. 18 is an illustration for explaining a process of assemblinga multiprocessor when the multiprocessor comprises a single back panel;

[0104]FIG. 19 is an illustration of a multiprocessor according to aneleventh embodiment of the present invention;

[0105]FIG. 20 is an illustration of a multiprocessor according to atwelfth embodiment of the present invention;

[0106]FIG. 21 is an illustration of a first variation of a crossbarboard-back panel assembly shown in FIG. 20;

[0107]FIG. 22 is an illustration of a second variation of the crossbarboard-back panel assembly shown in FIG. 20;

[0108]FIG. 23 is an illustration of a multiprocessor according to athirteenth embodiment of the present invention;

[0109]FIG. 24 is an illustration of a first connection part on each ofsmall panels shown in FIG. 23;

[0110]FIG. 25 is an illustration of a first variation of the firstconnection part shown in FIG. 24;

[0111]FIG. 26 is an illustration of a second variation of the firstconnection part shown in FIG. 24;

[0112]FIG. 27 is an illustration of a multiprocessor according to afourteenth embodiment of the present invention;

[0113]FIG. 28 is an illustration of a multiprocessor according to afifteenth embodiment of the present invention;

[0114]FIG. 29 is an illustration of a multiprocessor according to asixteenth embodiment of the present invention;

[0115]FIG. 30 is an illustration of a multiprocessor according to aseventeenth embodiment of the present invention;

[0116]FIG. 31A is a perspective view showing a first assembling methodof a crossbar board-back panel assembly shown in FIG. 2;

[0117]FIG. 31B is a side view showing the first assembling method of thecrossbar board-back panel assembly shown in FIG. 2;

[0118]FIG. 32A is a perspective view showing a second assembling methodof the crossbar board-back panel assembly shown in FIG. 2;

[0119]FIG. 32B is a side view showing the second assembling method ofthe crossbar board-back panel assembly shown in FIG. 2;

[0120]FIG. 33 is an illustration of a first variation of the crossbarboard-back panel assembly shown in FIG. 2;

[0121]FIG. 34 is an illustration of a second variation of the crossbarboard-back panel assembly shown in FIG. 2;

[0122]FIG. 35A is an illustration of a third variation of the crossbarboard-back panel assembly shown in FIG. 2;

[0123]FIG. 35B is an illustration of a server including a room tocontain the crossbar board-back panel assembly shown in FIG. 35A;

[0124]FIG. 35C is an illustration of the server shown in FIG. 35Bcontaining the crossbar board-back panel assembly shown in FIG. 35A inthe room;

[0125]FIG. 36A is an illustration of the crossbar-board being connectedto the first back panel, of a fourth variation of the crossbarboard-back panel assembly shown in FIG. 2;

[0126]FIG. 36B is a cross-sectional view of a connection pin shown inFIG. 36A before being inserted into a connection block;

[0127]FIG. 36C is a cross-sectional view of the connection pin shown inFIG. 36A inserted into the connection block;

[0128]FIG. 36D is a cross-sectional view of the connection pin shown inFIG. 36A bending upward in the connection block;

[0129]FIG. 37 is an illustration of a fifth variation of the crossbarboard-back panel assembly shown in FIG. 2;

[0130]FIG. 38 is an illustration of a connection part of thecrossbar-board and the first back panel, of a sixth variation of thecrossbar board-back panel assembly shown in FIG. 2;

[0131]FIG. 39 is an illustration of a connection part of thecrossbar-board and the first back panel, of a seventh variation of thecrossbar board-back panel assembly shown in FIG. 2;

[0132]FIG. 40 is an illustration of an eighth variation of the crossbarboard-back panel assembly shown in FIG. 2; and

[0133]FIG. 41 is an illustration of a ninth variation of the crossbarboard-back panel assembly shown in FIG. 2.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0134] A description will now be given, with reference to the drawings,of embodiments according to the present invention. It is noted that theessentially same elements are marked by the same reference characters,and with suffix reference characters when the essentially same elementsneed distinguishing in explanation.

[0135] 1. FIRST EMBODIMENT

[0136]FIG. 2 is an illustration of a multiprocessor 50 according to afirst embodiment of the present invention. FIG. 3 is a plan view of themultiprocessor 50 shown in FIG. 2. The multiprocessor 50 is an SMP(Symmetric Multiprocessor) of the crossbar-interconnect type. Themultiprocessor 50 includes 16 motherboards 51-1 to 51-16, and is capableof processing numerous information. The multiprocessor 50 is alsocapable of switching connections between any two motherboards 51-nselected from the 16 motherboards 51-1 to 51-16. A server 90 comprisesthe multiprocessor 50 in a shelf 91 indicated by a double dashed chainline in FIG. 2.

[0137] In FIG. 2 and FIG. 3, a direction X1-X2 shows a width direction,a direction Y1-Y2 shows a depth direction, and a direction Z1-Z2 shows aheight direction. A plane X-Y is a horizontal plane, and a plane Y-Z anda plane X-Z are vertical planes.

[0138] The multiprocessor 50 comprises eight crossbar-boards 60-1 to60-8, a first back panel 70, a second back panel 80 and the 16motherboards 51-1 to 51-16.

[0139] Each of the eight crossbar-boards 60-1 to 60-8 is rectangular andis placed horizontal. The eight crossbar-boards 60-1 to 60-8 are alignedin the direction Z1-Z2 at regular intervals. However, depending onarrangements of connectors on the back panels 70 and 80, thecrossbar-boards may be aligned at irregular intervals. This applies alsoto the following other embodiments.

[0140] The first back panel 70 is placed vertical, and is connected to alongitudinal side 62 a of two longitudinal sides 62 a and 62 b at bothsides of each of the eight crossbar-boards 60-1 to 60-8 by connectors.

[0141] The second back panel 80 is also placed vertical, and isconnected to the other longitudinal side 62 b of each of the eightcrossbar-boards 60-1 to 60-8 by connectors.

[0142] Each of eight motherboards 51-1 to 51-8 of the 16 motherboards51-1 to 51-16 is placed vertical, and is inserted into the first backpanel 70 in a direction indicated by an arrow Y1 so as to be plugged inand connected thereto. The eight motherboards 51-1 to 51-8 are alignedin the direction X1-X2 at regular intervals.

[0143] Each of the other eight motherboards 51-9 to 51-16 is placedvertical, and is inserted into the second back panel 80 in a directionindicated by an arrow Y2 so as to be plugged in and connected thereto.The other eight motherboards 51-9 to 51-16 are aligned in the directionX1-X2 at regular intervals.

[0144] The motherboard 51 comprises: a board 52; a CPU 53 and a memorymodule 54 each mounted thereon; and a plurality of jack-connectors 55fixed along an edge of the board 52 at an end in the direction indicatedby the arrow Y1 or Y2 in which the motherboard 51 is inserted into thefirst or second back panel.

[0145] The first back panel 70 comprises: a plurality of plug-connectors72 mounted on a surface 71 at which the motherboards 51 are connected;and a plurality of plug-connectors 74 mounted on a surface 73 at whichthe crossbar-boards 60 are connected.

[0146] The plurality of plug-connectors 72 on the surface 71 are used toconnect the first back panel 70 and the motherboards 51, and are alignedin the direction Z1-Z2 in eight rows, the eight rows being aligned inthe direction X1-X2 at regular intervals. The plurality ofplug-connectors 74 on the surface 73 are used to connect the first backpanel 70 and the crossbar-boards 60, and are aligned in the directionX1-X2 in eight rows, the eight rows being aligned in the direction Z1-Z2at regular intervals.

[0147]FIG. 4 is an illustration of a structure of the first back panel70 shown in FIG. 2. As shown magnified in FIG. 4, pins 75 aa to 75 ad ofeach of the plug-connectors 72 are electrically and mechanicallyconnected to and held in through holes 70 a to 70 d formed in the firstback panel 70, by soldering or press fitting. Also, pins 75 ba to 75 bdof each of the plug-connectors 74 on the opposite side to theplug-connectors 72 are electrically and mechanically connected to andheld in the through holes 70 a to 70 d formed in the first back panel 70by the same method. It should be noted that, although soldering or pressfitting is employed as a method of mounting the plug-connectors 72 and74 in the present embodiment, plug-connectors of a surface mount typeare also usable as the plug-connectors 72 and 74.

[0148] Each of the plurality of jack-connectors 55 fixed on themotherboard 51 has connection pins 55 a to 55 d correspondentrespectively to the pins 75 aa to 75 ad of the plug-connector 72.Thereby, the jack-connector 55 is engaged with the plug-connector 72.Each of a plurality of jack-connectors 64 fixed on the crossbar-board 60has connection pins 64 a to 64 d correspondent respectively to the pins75 ba to 75 bd of the plug-connector 74. Thereby, the jack-connector 64is engaged with the plug-connector 74.

[0149] The pins 75 aa to 75 ad of the plug-connector 72 have an equallength, while the connection pins 55 a to 55 d of the jack-connector 55have different lengths. Likewise, the pins 75 ba to 75 bd of theplug-connector 74 have an equal length, while the connection pins 64 ato 64 d of the jack-connector 64 have different lengths.

[0150] The lengths of these pins have relations shown by the followingexpressions. For conveniences' sake in explanation, the followingexpressions use the reference characters marking the pins as symbolsrepresenting the lengths thereof.

75aa=75ba=75ab=75bb=75ac=75bc=75ad=75bd(55a=64a)>(55b=64b)>(55c=64c)>(55d=64d)

[0151] The first back panel 70 has wiring patterns a to d connecting theplug-connector 72 and the plug-connector 74. The wiring pattern aconnects the pin 75 aa and the pin 75 bd, the pin 75 aa to be connectedto the longest connection pin 55 a of the jack-connector 55 and the pin75 bd to be connected to the shortest connection pin 64 d of thejack-connector 64. The wiring pattern b connects the pin 75 ab and thepin 75 bc, the pin 75 ab to be connected to the second longestconnection pin 55 b of the jack-connector 55 and the pin 75 bc to beconnected to the second shortest connection pin 64 c of thejack-connector 64. Also, for the wiring pattern c and the wiring patternd, the following shows connection paths from the jack-connector 55 tothe jack-connector 64: as for the wiring pattern c, the second shortestconnection pin 55 c→the pin 75 ac →the wiring pattern c→the pin 75 bb→the second longest connection pin 64 b; and, as for the wiring patternd, the shortest connection pin 55 d→the pin 75 ad→the wiring patternd→the pin 75 ba→the longest connection pin 64 a.

[0152] Here, when the connection pins of the jack-connectors 55 and 64have relations represented by the equation

“(55a+64d)=(55b+64c)=(55c+64b)=(55d+64a)=(a particular length)”

[0153] and the wiring patterns a to d of the first back panel 70 have anequal length, connection distances between connection points 55 a′ to 55d′ of the jack-connector 55 on the motherboard 51 and connection points64 d′ to 64 a′ of the jack-connector 64 on the crossbar-board 60,respectively, can all be made equal. With this method and anequal-length wiring on the crossbar-board, later described withreference to FIG. 3 and FIG. 6, a plurality of the motherboards can beconnected to a switching circuit 63 (101 or 102 in FIG. 6) on thecrossbar-board at an equal length.

[0154] Further, by equalizing connection distances between the CPU 53(or other MEM elements) and the connection points 55 a′ to 55 d′ in eachof the motherboards 51, a plurality of the CPUs 53 of the motherboardscan be connected at an equal length through the first back panel 70 andthe crossbar-board to the switching circuit thereon, whereby atransmission time of signals can be made equal. This achieves an optimalSMP.

[0155] In addition, even when the above-mentioned equation “(55 a+64d)=(55 b+64 c)=(55 c+64 b)=(55 d+64 a)=(a particular length)” does notstand for the connection pins of the jack-connectors 55 and 64,adjusting the lengths of the wiring patterns a to d of the first backpanel 70 can equalize all the connection distances between theconnection points 55 a′ to 55 d′ of the jack-connector 55 on themotherboard 51 and the connection points 64 d′ to 64 a′ of thejack-connector 64 on the crossbar-board 60, respectively, resulting inthe same effects.

[0156] This case is more apparent as shown below, using the followingvalues, for example, as the lengths of the connection pins of thejack-connectors 55 and 64.

[0157]55 a=64 a=(5 mm); 55 b=64 b=(4 mm); 55 c=64 c=(3.5 mm); 55 d=64d=(3 mm).

[0158] Then, (55 a+64 d)=(8 mm); (55 b+64 c)=7.5 mm; (55 c+64 b)=(7.5mm); (55 d+64 a)=(8 mm).

[0159] Here, the above-mentioned equation “(55 a+64 d)=(55 b+64 c)=(55c+64 b)=(55 d+64 a)=(a particular length)” does not stand.

[0160] However, arranging the lengths of the wiring patterns a to d ofthe first back panel 70 as follows can equalize all the connectiondistances between the connection points 55 a′-55 d′ and the connectionpoints 64 d′-64 a′.

[0161] (the length of the wiring pattern a)=(the length of the wiringpattern b)+((55 a+64 d)−(55 b+64 c))

[0162] (the length of the wiring pattern d)=(the length of the wiringpattern c)+((55 d+64 a)−(55 c+64 b))

[0163] (the length of the wiring pattern b)=(the length of the wiringpattern c)

[0164] This means that differences in the summed lengths of thecorresponding connection pins of the jack-connectors are compensated byadjusting the lengths of the wiring patterns so that the connectiondistances between the connection points 55 a′-55 d′ and the connectionpoints 64 d′-64 a′, respectively, can all be made equal.

[0165] This method is applicable, as follows, when the correspondingconnection pins 55 a-55 d and 64 d-64 a of the jack-connectors are notactually connected yet, as shown in FIG. 4.

[0166] First, the pins 75 aa-75 ad and the pins 75 bd-75 ba areconnected by the wiring patterns a-d, respectively, at a possibleshortest length. Next, total connection distances including the lengthsof the pins 75 aa-75 ad, the pins 75 bd-75 ba, the wiring patterns a-d,the connection pins 55 a-55 d and the connection pins 64 d-64 a,respectively, are calculated. Then, differences between the longest ofthe total connection distances and the other total connection distancesare calculated. Finally, the differences are added to the lengths of thewiring patterns, respectively, achieving an equal-length connection onthe first back panel 70.

[0167] Additionally, the first back panel 70 may comprise theplug-connectors 72 and 74 in a manner shown in FIG. 5. FIG. 5 is anillustration of a variation of the first back panel 70 shown in FIG. 4.

[0168] As shown in FIG. 5, a long pin terminal 75 passes through thefirst back panel 70. Each of the plug-connectors 72 has a shroud 76, oneend 75 a of the pin terminal 75 projecting within the shroud 76. Each ofthe plug-connectors 74 has a shroud 77, the other end 75 b of the pinterminal 75 projecting within the shroud 77.

[0169] Also, as shown in FIG. 5, the first back panel 70 has thefollowing elements mounted on the surface 71: an electronic component 78a having a switching function; an electronic component 78 b having apassive driving function; an electronic component 78 c having a memoryor buffer function; a resistor 78 d; and a capacitor 78 e.

[0170] The first back panel 70 shown in FIG. 5 does not have the wiringpatterns. Accordingly, in order to achieve an equal-length connection:first, connection distances between the connection points 55 a′ to 55 d′of the jack-connector 55 on the motherboard 51 and the connection points64 d′ to 64 a′ of the jack-connector 64 on the crossbar-board 60,respectively, are calculated; then, differences between the longest ofthe connection distances and the other connection distances arecalculated; finally, the differences are adjusted in wiring patterns onthe crossbar-board 60.

[0171] The second back panel 80 has the substantially same structure asthe first back panel 70, the second back panel 80 comprising: aplurality of plug-connectors 82 mounted on a surface 81 at which themotherboards 51 are connected; and a plurality of plug-connectors 84mounted on a surface 83 at which the crossbar-boards 60 are connected.

[0172] The plurality of plug-connectors 82 on the surface 81 are used toconnect the second back panel 80 and the motherboards 51, and arealigned in the direction Z1-Z2 in eight rows, the eight rows beingaligned in the direction X1-X2 at regular intervals. The plurality ofplug-connectors 84 on the surface 83 are used to connect the second backpanel 80 and the crossbar-boards 60, and are aligned in the directionX1-X2 in eight rows, the eight rows being aligned in the direction Z1-Z2at regular intervals. The plug-connectors 82 and 84 have the samestructures as the above-mentioned plug-connectors 72 and 74.

[0173] As shown in FIG. 3, each of the crossbar-boards 60 comprises: aboard 61; the switching circuit 63 mounted at the center of the uppersurface thereof; the eight jack-connectors 64 mounted along thelongitudinal side 62 a at positions corresponding to the plug-connectors74 of the first back panel 70; and eight jack-connectors 65 mountedalong the other longitudinal side 62 b at positions corresponding to theplug-connectors 84 of the second back panel 80. The board 61 has: aplurality of wiring patterns 66 connecting the eight jack-connectors 64and corresponding terminals of the switching circuit 63, respectively;and a plurality of wiring patterns 67 connecting the eightjack-connectors 65 and corresponding terminals of the switching circuit63, respectively. Each of the plurality of wiring patterns 66 and theplurality of wiring patterns 67 is properly bent and has an equal lengthto another. That is, the crossbar-board 60 has an equal-length wiringwherein the plurality of wiring patterns 66 and the plurality of wiringpatterns 67 between the switching circuit 63 and the jack-connectors 64and 65, respectively, have the same length.

[0174] The eight jack-connectors 64 of the crossbar-board 60 areconnected to the plug-connectors 74 of the first back panel 70. Theeight jack-connectors 65 of the crossbar-board 60 are connected to theplug-connectors 84 of the second back panel 80. Therefore, the firstback panel 70 and the second back panel 80 flank the crossbar-board 60at both sides thereof.

[0175] Here, a connection part of the jack-connecter 55, theplug-connector 72, the plug-connector 74 and the jack-connecter 64 isreferred to as a first connection part 95. Also, a connection of thejack-connecter 55, the plug-connector 82, the plug-connector 84 and thejack-connecter 65 is referred to as a second connection part 96.

[0176] In the multiprocessor 50 having the above-mentioned structure,any two of the motherboards 51-1 to 51-16 can be connected to each otherin the following three manners of connection. It is noted that aconnection between any two of the motherboards 51-1 to 51-16 means, forconveniences' sake in explanation, a connection between the CPU 53 ofone motherboard 51 and the memory module 54 of the other motherboard 51.

[0177] (1) A connection between any two of the motherboards 51-1 to 51-8plugged in and connected to the first back panel 70.

[0178] For example, the motherboards 51-1 and 51-7 are connected by thefirst connection part 95-1, the wiring pattern 66-1, the switchingcircuit 63, the wiring pattern 66-7 and the first connection part 95-7.

[0179] (2) A connection between any two of the motherboards 51-9 to51-16 plugged in and connected to the second back panel 80.

[0180] For example, the motherboards 51-11 and 51-14 are connected bythe second connection part 96-3, the wiring pattern 67-3, the switchingcircuit 63, the wiring pattern 67-6 and the second connection part 96-6.

[0181] (3) A connection between any one of the motherboards 51-1 to 51-8plugged in and connected to the first back panel 70 and any one of themotherboards 51-9 to 51-16 plugged in and connected to the second backpanel 80.

[0182] For example, the motherboards 51-1 and 51-11 are connected by thefirst connection part 95-1, the wiring pattern 66-1, the switchingcircuit 63, the wiring pattern 67-3 and the second connection part 96-3.

[0183] It should be noted that, when a signal is transmitted by the CPU53 to the memory module 54 of the same motherboard 51, the signal istransmitted via the switching circuit 63 of the crossbar-board 60whereat the signal is turned back. In this case, a transmission distanceof the signal is equal to cases according to the above-mentioned mannersof connections (1) to (3). Accordingly, an access speed of the CPU 53 tothe memory module 54 of the same motherboard 51 is equal to the casesaccording to the above-mentioned manners of connections (1) to (3).

[0184] The above-mentioned multiprocessor 50 has the following features.

[0185] 1. The multiprocessor 50 is capable of processing information ata higher speed than a conventional multiprocessor.

[0186] Connection paths according to the above-mentioned manners ofconnections (1) to (3) have an equal length. This length is stillshorter than the connection path of the conventional multiprocessor 10by the length of the cable 30.

[0187] Hence, transmission distances of signals in the multiprocessor 50become short, reducing the likelihood of causing distortion of thetransmitting signals. Thereby, the conventional limitation restricting atransfer rate of signals is eased, and accordingly, the transfer rate ofthe signals can be raised higher than the conventional multiprocessor10. In this way, the multiprocessor 50 can process information at ahigher speed than a conventional multiprocessor.

[0188] 2. The multiprocessor 50 is an optimal SMP.

[0189] Since the connection paths according to the above-mentionedmanners of connections (1) to (3) have an equal length, the transmissiondistances of signals in the multiprocessor 50 are always the same,regardless of the manners of connections. Accordingly, each of the CPUs53 of the plurality of the motherboards 51 accesses each of the memorymodules 54 of the plurality of the motherboards 51 at an equal speed,achieving an optimal SMP.

[0190] 3. The multiprocessor 50 can have a structure smaller in sizethan a conventional multiprocessor.

[0191] Since the multiprocessor 50 does not use the cables 30 unlike theconventional multiprocessor 10, the multiprocessor 50 can have a smallstructure in size.

[0192] Accordingly, since the multiprocessor 50 is small in size, theserver 90 can also have a small structure of, for example, 1800 mm inheight, 1000 mm in width and 1000 mm in depth.

[0193] 4. The multiprocessor 50 is more reliable than a conventionalmultiprocessor.

[0194] Since the multiprocessor 50 does not have the cables 30, themultiprocessor 50 does not suffer a malfunction due to a poor connectionof the cables.

[0195] In FIG. 2, it is noted that a crossbar board-back panel assembly88 comprises the crossbar-boards 60-1 to 60-8, the first back panel 70and the second back panel 80.

[0196]FIG. 6 is an illustration of a crossbar-board 60A, which is avariation of the crossbar-board 60 of the multiprocessor 50, along withthe first back panel 70 and the second back panel 80.

[0197] As shown in FIG. 6, the crossbar-board 60A comprises: a board61A; a first switching circuit 101 mounted on a X2 side of the uppersurface of the board 61A; a second switching circuit 102 mounted on a X1side of the upper surface of the board 61A; and eight jack-connectors64A and eight jack-connectors 65A mounted at the same positions as theeight jack-connectors 64 and the eight jack-connectors 65, respectively,shown in FIG. 3. The board 61A has: a plurality of wiring patterns 103connecting the eight jack-connectors 64A and corresponding terminals ofthe first switching circuit 101, respectively; a plurality of wiringpatterns 104 connecting the eight jack-connectors 65A and correspondingterminals of the second switching circuit 102, respectively; and aplurality of wiring patterns 105 connecting the first switching circuit101 and the second switching circuit 102. Each of the plurality ofwiring patterns 103 is properly bent and has an equal length to another.Likewise, each of the plurality of wiring patterns 104 is properly bentand has an equal length to another. Additionally, each of the pluralityof wiring patterns 105 has an equal length to another. Here, the wiringpattern 103 has an equal length to the wiring pattern 104. That is, thecrossbar-board 60A also has an equal-length wiring.

[0198] Any two of the motherboards 51-1 to 51-16 are connected to eachother with the length of a connection path always being equal.

[0199] 2. SECOND EMBODIMENT

[0200]FIG. 7 is an illustration of a multiprocessor 50B according to asecond embodiment of the present invention. The multiprocessor 50B is anSMP (Symmetric Multiprocessor) of the crossbar-interconnect type. Themultiprocessor 50B includes eight more motherboards than themultiprocessor 50 shown in FIG. 2, totaling 24 motherboards 51-1 to51-24.

[0201] The multiprocessor 50B has a structure based on themultiprocessor 50 shown in FIG. 2, and further comprises themotherboards 51-17 to 51-24 extensively added in the direction indicatedby the arrow Y2. It is noted that extensively added boards and panelsare given names including the word “extension”.

[0202] The multiprocessor 50B comprises: the multiprocessor 50 shown inFIG. 2; a first extension back panel 110 connected by connectors to anedge of the motherboards 51-1 to 51-8 in the direction indicated by thearrow Y2; eight extension crossbar-boards 120-1 to 120-8 connected byconnectors to a surface of the first extension back panel 110 in thedirection indicated by the arrow Y2, each of the eight extensioncrossbar-boards 120-1 to 120-8 being placed horizontal and aligned inthe direction Z1-Z2 at regular intervals; a second extension back panel130 connected by connectors to an edge of the eight extensioncrossbar-boards 120-1 to 120-8 in the direction indicated by the arrowY2; and the eight extension motherboards 51-17 to 51-24 connected byconnectors to a surface of the second extension back panel 130 in thedirection indicated by the arrow Y2, each of the eight extensionmotherboards 51-17 to 51-24 being placed vertical and aligned in thedirection X1-X2 at regular intervals.

[0203] Further, the multiprocessor 50B may comprise more motherboards 51extensively added in the direction indicated by the arrow Y1 or Y2.

[0204] The multiprocessor 50B provides the same effects as theabove-mentioned multiprocessor 50.

[0205] 3. THIRD EMBODIMENT

[0206]FIG. 8 is an illustration of a multiprocessor 50C according to athird embodiment of the present invention. The multiprocessor 50C is anSMP (Symmetric Multiprocessor) of the crossbar-interconnect type. Themultiprocessor 50C includes 16 more motherboards than the multiprocessor50 shown in FIG. 2, totaling 32 motherboards 51-1 to 51-32.

[0207] The multiprocessor 50C basically has a structure comprising themultiprocessor 50 shown in FIG. 2; and another multiprocessor 50 placedthereupon. In other words, the multiprocessor 50B comprises: themultiprocessor 50; and the motherboards 51-17 to 51-32 and otherelements extensively added in the direction indicated by an arrow Z1. Itis noted that extensively added boards and panels are given namesincluding the word “extension”.

[0208] The multiprocessor 50C comprises: the multiprocessor 50 shown inFIG. 2; a first extension back panel 140 extensively connected by aconnector 170 to an edge of the first back panel 70 in the directionindicated by the arrow Z1; a second extension back panel 150 extensivelyconnected by a connector 180 to an edge of the second back panel 80 inthe direction indicated by the arrow Z1; eight extension crossbar-boards160-1 to 160-8 connected by connectors to opposing surfaces of the firstextension back panel 140 and the second extension back panel 150, eachof the eight extension crossbar-boards 160-1 to 160-8 being placedhorizontal and aligned in the direction Z1-Z2 at regular intervals;eight extension motherboards 51-17 to 51-24 connected by connectors to asurface of the first extension back panel 140 in the direction indicatedby the arrow Y2, each of the eight extension motherboards 51-17 to 51-24being placed vertical and aligned in the direction X1-X2 at regularintervals; and eight extension motherboards 51-25 to 51-32 connected byconnectors to a surface of the second extension back panel 150 in thedirection indicated by the arrow Y1, each of the eight extensionmotherboards 51-25 to 51-32 being placed vertical and aligned in thedirection X1-X2 at regular intervals.

[0209] Further, the multiprocessor 50C may comprise more motherboards 51extensively added in the direction indicated by the arrow Z1 or Z2.

[0210] The multiprocessor 50C provides the same effects as theabove-mentioned multiprocessor 50.

[0211] 4. FOURTH EMBODIMENT

[0212]FIG. 9 is an illustration of a multiprocessor 50D according to afourth embodiment of the present invention. The multiprocessor 50D is anSMP (Symmetric Multiprocessor) of the crossbar-interconnect type. Themultiprocessor 50D includes eight more motherboards than themultiprocessor 50 shown in FIG. 2, totaling 24 motherboards 51-1 to51-24, and is characterized in having a prismatic shape.

[0213] The multiprocessor 50D comprises: eight crossbar-boards 190-1 to190-8; the first back panel 70; the second back panel 80; a third backpanel 195; and the 24 motherboards 51-1 to 51-24.

[0214] Each of the eight crossbar-boards 190-1 to 190-8 is anequilateral triangle, and comprises: a plurality of connecters 191mounted along three laterals thereof; and switching circuits 192 and 193mounted on the upper surface of each of the eight crossbar-boards 190-1to 190-8. Each of the eight crossbar-boards 190-1 to 190-8 is placedhorizontal and aligned in the direction Z1-Z2 at regular intervals.

[0215] The first back panel 70, the second back panel 80 and the thirdback panel 195 are each placed vertical, and are connected by connectersto three sides of the eight crossbar-boards 190-1 to 190-8, forming ashape of an equilaterally triangular prism.

[0216] The motherboards 51-1 to 51-8, the motherboards 51-9 to 51-16 andthe motherboards 51-17 to 51-24 are connected by connecters to the firstback panel 70, the second back panel 80 and the third back panel 195,respectively. Each of the motherboards 51-1 to 51-8, the motherboards51-9 to 51-16 and the motherboards 51-17 to 51-24 is placed vertical.The motherboards 51-1 to 51-8, the motherboards 51-9 to 51-16 and themotherboards 51-17 to 51-24 are aligned widthwise of the first backpanel 70, the second back panel 80 and the third back panel 195,respectively.

[0217] The multiprocessor 50D provides the same effects as theabove-mentioned multiprocessor 50.

[0218] Further, the multiprocessor 50D may comprise crossbar-boardshaving a shape of a square, a regular pentagon, a regular hexagon, otherregular polygons, a triangle, a quadrilateral, a pentagon, a hexagon, orother polygons, etc. Thereby, the multiprocessor 50D has a prismaticshape in accordance with the shape of the crossbar-boards.

[0219] 5. FIFTH EMBODIMENT

[0220]FIG. 10 is an illustration of a multiprocessor 50E according to afifth embodiment of the present invention. FIG. 11 is a side view of themultiprocessor 50E shown in FIG. 10. The multiprocessor 50E is an SMP(Symmetric Multiprocessor) of the crossbar-interconnect type. In themultiprocessor 50E, the crossbar-boards are connected to the back panelsby connecters facing different directions than in the multiprocessor 50shown in FIG. 2.

[0221] The multiprocessor 50E comprises: eight crossbar-boards 60E-1 to60E-8; a first back panel 70E; a second back panel 80E; and the 16motherboards 51-1 to 51-16.

[0222] Each of the eight crossbar-boards 60E-1 to 60E-8 comprises: theboard 61; the switching circuit 63 mounted at the center of an uppersurface 61 a thereof; and eight jack-connectors 200 and eightjack-connectors 201 mounted along both longitudinal sides, respectively,of an under surface 61 b of the board 61, as shown in FIG. 10 and FIG.11. A joining part of each of the eight jack-connectors 200 and theeight jack-connectors 201 faces in the direction indicated by the arrowZ2, as shown in FIG. 11.

[0223] The first back panel 70E has a plurality of plug-connectors 202mounted on a surface 73E. A pin of each of the plurality ofplug-connectors 202 faces in the direction indicated by the arrow Z1.The second back panel 80E has a plurality of plug-connectors 203 mountedon a surface 83E. A pin of each of the plurality of plug-connectors 203faces in the direction indicated by the arrow Z1.

[0224] Each of the eight crossbar-boards 60E-1 to 60E-8 is placedhorizontal and aligned in the direction Z1-Z2 at regular intervals.

[0225] The first back panel 70E and the second back panel 80E are eachplaced vertical, and oppose each other.

[0226] The jack-connectors 200 and the jack-connectors 201 of thecrossbar-boards 60E-1 to 60E-8 are connected to the plug-connectors 202of the first back panel 70E and the plug-connectors 203 of the secondback panel 80E, respectively. Each of the motherboards 51-1 to 51-16 isplaced vertical. The motherboards 51-1 to 51-8 and the motherboards 51-9to 51-16 are connected by connectors to the first back panel 70E and thesecond back panel 80E, respectively, and are aligned in the directionX1-X2 at regular intervals.

[0227] In order that the jack-connectors 200 and the jack-connectors 201are connected to the plug-connectors 202 and the plug-connectors 203,respectively, each of the crossbar-boards 60E-1 to 60E-8 is pusheddownward in the direction Z2, as indicated by an arrow C2 in FIG. 11. Inorder that the jack-connectors 200 and the jack-connectors 201 aredisconnected from the plug-connectors 202 and the plug-connectors 203,respectively, each of the crossbar-boards 60E-1 to 60E-8 is pushedupward in the direction Z1, as indicated by an arrow C1 in FIG. 11.

[0228] For example, the crossbar-board 60E-5 is removed from themultiprocessor 50E by firstly pushing upward the crossbar-board 60E-5 inthe direction Z1, as indicated by the arrow C1 in FIG. 11, so as todisconnect the jack-connectors 200 and the jack-connectors 201 from theplug-connectors 202 and the plug-connectors 203, and secondly drawingthe crossbar-board 60E-5 in the direction X2, as indicated by the arrowD2 in FIG. 10. A new crossbar-board 60E is attached to themultiprocessor 50E reversely by firstly inserting the crossbar-board60E-5 from a side of the multiprocessor 50E as indicated by the arrow D1in FIG. 10, and secondly pushing downward the crossbar-board 60E-5 asindicated by the arrow C2 in FIG. 11.

[0229] Therefore, when one of the crossbar-boards 60E-1 to 60E-8 goesout of order, the broken crossbar-board 60E can be replaced by a newcrossbar-board 60E without disassembling the multiprocessor 50E, i.e.,without moving or removing the opposing first back panel 70E and thesecond back panel 80E. Thereby, a maintenance of the multiprocessor 50Erequires a small number of steps, and thus the multiprocessor 50E has agood maintainability.

[0230] 6. SIXTH EMBODIMENT

[0231]FIG. 12 is an illustration of a multiprocessor 50F according to asixth embodiment of the present invention. The multiprocessor 50F is anSMP (Symmetric Multiprocessor) of the crossbar-interconnect type, andcomprises a plurality of heat radiation components 210 in addition tothe structure of the multiprocessor 50 shown in FIG. 2.

[0232] Each of the heat radiation components 210 is a hollow aluminumcomponent comprising a hollow space 211 having a rectangular crosssection, and is placed horizontally on the upper side of each of thecrossbar-boards 60-1 to 60-8 so as to contact an upper surface of theswitching circuit 63. Each of the heat radiation components 210 isplaced in a space between the adjacent crossbar-boards 60. A size of thehollow space 211 is determined optimally according to a relation betweena quantity and a speed of a cooling wind.

[0233] A server incorporating the multiprocessor 50F has a cooling fan,whereby a cooling wind moves in the direction X1 as indicated by anarrow 212 while contacting outer and inner surfaces of each of the heatradiation components 210. Thereby, a heat generated in the switchingcircuit 63 of each of the crossbar-boards 60-1 to 60-8 is effectivelydeprived, and thus the switching circuit 63 can be efficientlyforced-air cooled.

[0234] 7. SEVENTH EMBODIMENT

[0235]FIG. 13 is an illustration of a multiprocessor 50G according to aseventh embodiment of the present invention. The multiprocessor 50G isan SMP (Symmetric Multiprocessor) of the crossbar-interconnect type, andcomprises a first power supply unit 221 and a second power supply unit222 in addition to the structure of the multiprocessor 50 shown in FIG.2.

[0236] The first power supply unit 221 and the second power supply unit222 are independent of each other. The first power supply unit 221 isconnected to the first back panel 70. The second power supply unit 222is connected to the second back panel 80. The first power supply unit221 and the second power supply unit 222 are connected in parallel. Eachof the first power supply unit 221 and the second power supply unit 222has a capacity to supply the entire multiprocessor 50G with a requiredelectric power without an aid of the other.

[0237] The first power supply unit 221 supplies an electric power to thefirst back panel 70, the eight motherboards 51-1 to 51-8 and thecrossbar-boards 60-1 to 60-8. The second power supply unit 222 suppliesan electric power to the second back panel 80 and the other eightmotherboards 51-9 to 51-16. When the first power supply unit 221 goesout of order, the second power supply unit 222 supplies an electricpower to the first back panel 70, the eight motherboards 51-1 to 51-8and the crossbar-boards 60-1 to 60-8 so that the multiprocessor 50Gcontinues to operate normally. When the second power supply unit 222goes out of order, the first power supply unit 221 supplies an electricpower to the second back panel 80 and the other eight motherboards 51-9to 51-16 so that the multiprocessor 50G continues to operate normally.

[0238] 8. EIGHTH EMBODIMENT

[0239]FIG. 14 is an illustration of a multiprocessor 50H according to aneighth embodiment of the present invention. The multiprocessor 50H is anSMP (Symmetric Multiprocessor) of the crossbar-interconnect type, andcomprises the substantially same structure as the multiprocessor 50shown in FIG. 2, except that the multiprocessor 50H has a larger size inthe direction X1-X2 than the multiprocessor 50 shown in FIG. 2.

[0240] A first back panel 70H and a second back panel 80H have a largersize in the direction X1-X2 than the first back panel 70 and the secondback panel 80 shown in FIG. 2. Each of the twelve motherboards 51-1 to51-12 is connected to the first back panel 70H by connectors, and isplaced vertically. The twelve motherboards 51-1 to 51-12 are aligned inthe direction X1-X2 at regular intervals. Each of the other twelvemotherboards 51-13 to 51-24 is connected to the second back panel 80H byconnectors, and is placed vertically. The other twelve motherboards51-13 to 51-24 are aligned in the direction X1-X2 at regular intervals.

[0241] Each of crossbar-board assemblies 230-1 to 230-8 has arectangular shape, and is placed horizontally. The crossbar-boardassemblies 230-1 to 230-8 are aligned in the direction Z1-Z2 at regularintervals. The first back panel 70H and the second back panel 80H arerespectively connected to both sides of the crossbar-board assemblies230-1 to 230-8 by connectors, and oppose each other.

[0242] The crossbar-board assembly 230-1 comprises extensioncrossbar-boards 231 and 232 respectively connected to both ends of thecrossbar-board 60-1 shown in FIG. 2 in longitudinal directions thereof.The board 61 of the crossbar-board 60-1 has wiring patterns toaccommodate the extension crossbar-boards 231 and 232. The extensioncrossbar-boards 231 and 232 each have wiring patterns analogous to thewiring patterns of the board 61.

[0243]FIG. 15 is a magnified illustration of a connecting part of theextension crossbar-board 231 and the crossbar-board 60-1 shown in FIG.14. As shown also in FIG. 15, the extension crossbar-board 231 and thecrossbar-board 60-1 are connected by a parallel-board connector (astacking connector) 240, electrically. Mechanically, the extensioncrossbar-board 231 and the crossbar-board 60-1 are fixed from both upperand under sides by board-shaped reinforcing metal articles 250 and 251,and are screwed with screws 253 and 254. FIG. 14 shows the connectingpart with the reinforcing metal article 250 removed.

[0244] The stacking connector 240 comprises: a flat-cable unit 241;stacking male-connectors 242 and 243 respectively attached on both endsof the under surface of the flat-cable unit 241; a stackingfemale-connector 244 attached on one end of the upper surface of theextension crossbar-board 231; and a stacking female-connector 245attached on one end of the upper surface of the board 61. The stackingmale-connectors 242 and 243 are connected to the stackingfemale-connectors 244 and 245, respectively.

[0245] In the same manner, the extension crossbar-board 232 and thecrossbar-board 60-1 are connected by a parallel-board connector (astacking connector) 240 a, board-shaped reinforcing metal articles 250 aand 251 a, and screws.

[0246] Namely, the crossbar-board assembly 230-1 has a structure whereinthe crossbar-board 60-1 is extended in the longitudinal directionsthereof. The other crossbar-board assemblies 230-2 to 230-8 have thesame structure as the crossbar-board assembly 230-1. Therefore, thecrossbar-board assembly 230 corresponding to the back panels 70H and 80Hlonger in the direction X1-X2 than normal can be manufactured by using aconventional reflow furnace.

[0247] 9. NINTH EMBODIMENT

[0248]FIG. 16 is an illustration of a multiprocessor 50I according to aninth embodiment of the present invention. The multiprocessor 50I has asimilar structure to the multiprocessor 50H shown in FIG. 14. However,the multiprocessor 50I comprises: extension crossbar-boards 255respectively connected to one end of the crossbar-boards 60-1 to 60-8 inthe longitudinal direction thereof; and flexible cable connectors 256each having connectors on both ends of a flexible substrate. Theextension crossbar-boards 255 are connected to a first back panel 70Iand a second back panel 80I in the same manner as the crossbar-boards60-1 to 60-8. Each of the flexible cable connectors 256 connects one endof the extension crossbar-board 255 and the second back panel 80I by theconnectors.

[0249] Each of the flexible cable connectors 256 provides one moreconnection part between the extension crossbar-board 255 and the secondback panel 80I than normal.

[0250] 10. TENTH EMBODIMENT

[0251]FIG. 17 is an illustration of a multiprocessor 50J according to atenth embodiment of the present invention. The multiprocessor 50J is anSMP (Symmetric Multiprocessor) of the crossbar-interconnect type, andhas a structure different from the structure of the multiprocessor 50shown in FIG. 2 with respect to motherboards and back panels.

[0252] The multiprocessor 50J comprises the eight crossbar-boards 60-1to 60-8 and 16 motherboards 51J-1 to 51J-16.

[0253] The motherboard 51J comprises: the motherboard 51 shown in FIG.2; and a strip panel 260 or 261 connected thereto. Each of the strippanels 260 and 261 has a width W corresponding to the motherboard 51shown in FIG. 2. For example, the motherboard 51J-8 comprises: themotherboard 51 shown in FIG. 2; and the strip panel 260-8 connected toone end of the motherboard 51 in the direction indicated by the arrowY1. The motherboard 51J-9 comprises: the motherboard 51 shown in FIG. 2;and the strip panel 261-9 connected to one end of the motherboard 51 inthe direction indicated by the arrow Y2.

[0254] Each of the eight motherboards 51J-1 to 51J-8 is placed vertical.The motherboards 51J-1 to 51J-8 are inserted toward the eightcrossbar-boards 60-1 to 60-8 in a direction indicated by an arrow A, andare plugged in and connected thereto. The motherboards 51J-1 to 51J-8are aligned in the direction X1-X2 at regular intervals. Each of theother eight motherboards 51J-9 to 51J-16 is placed vertical. Themotherboards 51J-9 to 51J-16 are inserted toward the eightcrossbar-boards 60-1 to 60-8 in a direction indicated by an arrow B, andare plugged in and connected thereto. The motherboards 51J-9 to 51J-16are aligned in the direction X1-X2 at regular intervals.

[0255] The strip panels 260-1 to 260-8 form a first back panel 70J. Thestrip panels 261-9 to 261-16 form a second back panel 80J.

[0256] The multiprocessor 50J comprises the first back panel 70J and thesecond back panel 80J divided into strips for each of the motherboards51J, and thus can easily be enlarged.

[0257] Additionally, when the multiprocessor comprises a single backpanel, the multiprocessor is assembled in a manufactory, as shown inFIG. 18, by fixing peripheries of a back panel 265 to a rack frame 266;and pushing the crossbar-boards 60-1 to 60-8 as indicated by an arrow Eland connecting by connectors the crossbar-boards 60-1 to 60-8 to theback panel 265 one by one. In this process, each of the crossbar-boards60-1 to 60-8 has to be pushed forcefully so that all connectors of thecrossbar-board 60 are connected to the back panel 265 simultaneously.This sometimes causes the back panel 265 to warp as depicted by a doubledashed chain line in FIG. 18. As a result of this, when the motherboard51 is plugged in and connected to the back panel 265 as indicated by anarrow E2 after the above-mentioned process, there is a risk of imperfectconnections between the motherboard 51 and the back panel 265.

[0258] However, when the multiprocessor comprises the first back panel70J and the second back panel 80J divided into strips for each of themotherboards 51J as in the present embodiment, the multiprocessor isassembled by first fixing the crossbar-boards 601 to 60-8 in a rackframe (not shown in the figures); and then plugging and connecting eachof the motherboards 51J comprising the strip panel 260 or 261 to thecrossbar-boards 60-1 to 60-8. This does not warp the strip panels 260 or261. Therefore, the motherboards 51J have good connections to thecrossbar-boards 60-1 to 60-8.

[0259] 11. ELEVENTH EMBODIMENT

[0260]FIG. 19 is an illustration of a multiprocessor 50K according to aneleventh embodiment of the present invention. The multiprocessor 50K isan SMP (Symmetric Multiprocessor) of the crossbar-interconnect type, andhas substantially the same structure as the multiprocessor 50J shown inFIG. 17, the structure being different from the structure of themultiprocessor 50 shown in FIG. 2 with respect to back panels.

[0261] The multiprocessor 50K comprises: the eight crossbar-boards 60-1to 60-8; a first back panel 70K; a second back panel 80K; and the 16motherboards 51-1 to 51-16.

[0262] The first back panel 70K is formed by the strip panels 260-1 to260-8 shown in FIG. 17. Each of the strip panels 260-1 to 260-8 isconnected by connectors to the crossbar-boards 60-1 to 60-8, and forms aplane in the direction X1-X2 together with the others. Likewise, thesecond back panel 80K is formed by the strip panels 261-9 to 261-16shown in FIG. 17. Each of the strip panels 261-9 to 261-16 is connectedby connectors to the crossbar-boards 60-1 to 60-8, and forms a plane inthe direction X1-X2 together with the others.

[0263] The multiprocessor 50K comprises the first back panel 70K and thesecond back panel 80K divided into strips for each of the motherboards51, and thus can easily be enlarged.

[0264] Additionally, the multiprocessor 50K is assembled by first fixingthe crossbar-boards 60-1 to 60-8 in a rack frame (not shown in thefigures); and then connecting by connectors the strip panels 260-1 to260-8 and 261-9 to 261-16 to the crossbar-boards 60-1 to 60-8 one byone. This forms the first back panel 70K and the second back panel 80kwithout warps. Therefore, the motherboards 51 can have good connectionsto the first back panel 70K and the second back panel 80k.

[0265] 12. TWELFTH EMBODIMENT

[0266]FIG. 20 is an illustration of a multiprocessor 50L according to atwelfth embodiment of the present invention. The multiprocessor 50L isan SMP (Symmetric Multiprocessor) of the crossbar-interconnect type, andhas a structure different from the structure of the multiprocessor 50shown in FIG. 2 with respect to back panels.

[0267] The multiprocessor 50L comprises: the eight crossbar-boards 60-1to 60-8; a first back panel 70L; a second back panel 80L; and the 16motherboards 51-1 to 51-16.

[0268] The first back panel 70L comprises strip panels 270-1 to 270-8being oblong in the direction X1-X2 so as to fit the crossbar-boards60-1 to 60-8, respectively. The strip panels 270-1 to 270-8 areconnected by connectors to the crossbar-boards 60-1 to 60-8,respectively, and form a plane in the direction Z1-Z2. The second backpanel 80L comprises strip panels 280-1 to 280-8 being oblong in thedirection X1-X2 so as to fit the crossbar-boards 60-1 to 60-8,respectively. The strip panels 280-1 to 280-8 are connected byconnectors to the crossbar-boards 60-1 to 60-8, respectively, and form aplane in the direction Z1-Z2.

[0269] Each of the motherboards 51-1 to 51-8 crosses over the strippanels 270-1 to 270-8. Each of the motherboards 51-9 to 51-16 crossesover the strip panels 280-1 to 280-8.

[0270] The multiprocessor 50L comprises the first back panel 70L and thesecond back panel 80L divided into strips for each of thecrossbar-boards 60, and thus can easily be enlarged.

[0271] The crossbar-boards 60-1 to 60-8, the first back panel 70L andthe second back panel 80L compose a crossbar board-back panel assembly300 which is a core of the multiprocessor 50L.

[0272] The crossbar board-back panel assembly 300 also comprises: apower supply unit 290 outputting a voltage V1; and a power supply unit291 outputting a voltage V2. The power supply unit 290 is connected tothe strip panels 270 and 280 suffixed with even numbers, i.e., the strippanels 270-2, 270-4, 270-6, 270-8, 280-2, 280-4, 280-6 and 280-8. Thepower supply unit 291 is connected to the strip panels 270 and 280suffixed with odd numbers, i.e., the strip panels 270-1, 270-3, 270-5,270-7, 280-1, 280-3, 280-5 and 280-7. Each of the motherboards 51-1 to51-16 has two power-supplied layers.

[0273] Accordingly, the voltage V1 is impressed to one of the twopower-supplied layers of each of the motherboards 51-1 to 51-16. Thevoltage V2 is impressed to the other of the two power-supplied layers ofeach of the motherboards 51-1 to 51-16. That is, two different voltagesare impressed to each of the motherboards 51-1 to 51-16. Therefore,semiconductor elements operable at the voltage V1 and semiconductorelements operable at the voltage V2 can be mounted together on each ofthe motherboards 51-1 to 51-16.

[0274]FIG. 21 is an illustration of a crossbar board-back panel assembly300A, which is a first variation of the above-mentioned crossbarboard-back panel assembly 300 shown in FIG. 20. The crossbar board-backpanel assembly 300A comprises: guide poles 303-1 to 303-4 placed atpositions corresponding to four corners of the crossbar-boards 60; andcrossbar board-strip panel assemblies 301-8 to 301-1 piled up and fixedby holes 302 formed at the four corners of the crossbar-boards 60-1 to60-8 being passed through by the guide poles 303-1 to 303-4,respectively.

[0275] The crossbar board-strip panel assembly 301-1 comprises: thecrossbar-board 60-1; and the strip panels 270-1 and 280-1 connectedrespectively to both longitudinal sides of the crossbar-board 601 byconnectors. The other crossbar board-strip panel assemblies 301-2 to301-8 have the same structure as the crossbar board-strip panel assembly301-1.

[0276] The guide poles 303-1 to 303-4 are made of aluminum, andconnected with a power supply unit 304. The crossbar-boards 60 compriseterminal members 305 respectively formed at positions facing the holes302. The terminal members 305 respectively contact the guide poles 303-1to 303-4 in a state where the crossbar board-strip panel assemblies301-8 to 301-1 are piled up. Thereby, the power supply unit 304 caneffectively supply a voltage to all of the crossbar-boards 60-1 to 60-8via the guide poles 303-1 to 303-4, and further to the first back panel70L and the second back panel 80L. Therefore, this structure isespecially effective when applied to a case where a large power issupplied to the crossbar-boards 60-1 to 60-8 and a case where a largepower is supplied to the back panels 70L and 80L. Specifically, thisstructure is capable of preventing voltage drops in the crossbar-boards60-1 to 60-8 and in the back panels 70L and 80L.

[0277]FIG. 22 is an illustration of a crossbar board-back panel assembly300B, which is a second variation of the above-mentioned crossbarboard-back panel assembly 300 shown in FIG. 20. The crossbar board-backpanel assembly 300B comprises: the crossbar board-strip panel assemblies301-1 to 3018; and a plurality of guide rails 310 fixed horizontally atpositions corresponding to the crossbar board-strip panel assemblies301-1 to 301-8. That is, both upper and under edges of each of the strippanels 270-1 to 270-8 and 280-1 to 280-8 on both sides of the crossbarboard-strip panel assemblies 301-1 to 301-8 are inserted into the guiderails 310 so that the crossbar board-strip panel assemblies 301-1 to301-8 are piled up.

[0278] The strip panels 270-1 to 270-8 together form a plane so as tocompose the first back panel 70L. The strip panels 280-1 to 280-8together form a plane so as to compose the second back panel 80L.

[0279] Each of the guide rails 310 comprises springy power supplyterminals 311 incorporated therein. The power supply terminals 311 areconnected with a power supply unit 312. The power supply unit 312impresses a voltage to all of the strip panels 270-1 to 270-8 and 280-1to 280-8 via the power supply terminals 311 in the guide rails 310.Thus, this structure is capable of preventing voltage drops in the backpanels 70L and 80L.

[0280] Additionally, any of the crossbar board-strip panel assemblies301-1 to 301-8 can be drawn out in a direction G2 shown in FIG. 22.Therefore, when one of the crossbar board-strip panel assemblies 301-1to 301-8 goes out of order, the broken crossbar board-strip panelassembly 301 can be easily replaced. This facilitates a maintenance ofthe crossbar board-back panel assembly 300B.

[0281] 13. THIRTEENTH EMBODIMENT

[0282]FIG. 23 is an illustration of a multiprocessor 50M according to athirteenth embodiment of the present invention. The multiprocessor 50Mis an SMP (Symmetric Multiprocessor) of the crossbar-interconnect type,and has a structure different from the structure of the multiprocessor50 shown in FIG. 2 with respect to back panels.

[0283] The multiprocessor 50M comprises: the crossbar-boards 60-1; afirst back panel 70M; a second back panel 80M; and the motherboards 51.

[0284] The first back panel 70M comprises: a grid-like frame 320; andfour small panels 321 each having a quarter size of the first back panel70M, two of the four small panels 321 being arranged in the frame 320 inthe direction X1-X2 and the other two of the four small panels 321 beingarranged in the frame 320 in the direction Z1-Z2. The second back panel80M comprises: a grid-like frame 330; and four small panels 331 eachhaving a quarter size of the second back panel 80M, two of the foursmall panels 331 being arranged in the frame 330 in the direction X1-X2and the other two of the four small panels 331 being arranged in theframe 330 in the direction Z1-Z2.

[0285] The small panels 321 of the first back panel 70M are suppliedwith a voltage via the frame 320. The small panels 331 of the secondback panel 80M are supplied with a voltage via the frame 330.

[0286] The first back panel 70M and the second back panel 80M can beenlarged by multiplying the small panels 321 and 331 arranged in thedirection X1-X2 and in the direction Z1-Z2.

[0287] It should be noted that each of the small panels 321 and 331 canbe minimized in size so as to have only one set of connectors forconnecting the crossbar-board 60 and the motherboard 51.

[0288]FIG. 24 is an illustration of a structure of a first connectionpart 95M on each of the small panels 321 shown in FIG. 23. The smallpanel 321 is supported in a floating state where the small panel 321 ismovable slightly in the plane X-Z. The small panel 321 comprises: aplug-connector 72M mounted on a surface 321 a so as to be connected tothe motherboard 51-1; and a plug-connector 74M mounted on a surface 321b so as to be connected to the crossbar-board 60-1. The plug-connector72M and the plug-connector 74M are connected by wiring patterns in thesmall panel 321.

[0289] The small panel 321 also comprises: a guide pin 340 passedthrough and fixed at a position of the small panel 321 under theplug-connector 72M and by a side of the plug-connector 74M; a guidecylinder 341 placed above the plug-connector 72M on the surface 321 a;and a guide cylinder 342 placed by the other side of the plug-connector74M on the surface 321 b. The guide pin 340 has: a guide-pin part 340 aprojecting in the direction Y2 on the surface 321 a; and a guide-pinpart 340 b projecting in the direction Y1 on the surface 321 b. That is,the guide-pin part 340 a and the guide cylinder 341 are placed under andabove the plug-connector 72M in the directions Z2-Z1, respectively. Theguide-pin part 340 b and the guide cylinder 342 are placed on both sidesof the plug-connector 74M in the directions X1-X2, respectively.

[0290] A jack-connector 55M of the motherboard 51-1 has a guide cylinder343 and a guide pin 344 placed under and above the jack-connector 55M inthe directions Z2-Z1, respectively. A jack-connector 64M of thecrossbar-board 60-1 has a guide cylinder 345 and a guide pin 346 placedon both sides of the jack-connector 64M in the directions X1-X2,respectively.

[0291] In assembling the multiprocessor 50M, when the crossbar-board60-1 is moved in a direction indicated by an arrow B and is connected tothe first back panel 70M comprising the small panels 321, the guide pin346 is inserted into the guide cylinder 342, and the guide cylinder 345has the guide-pin part 340 b inserted therein. Subsequently, the smallpanel 321 is moved slightly in the plane X-Z so that the plug-connector74M oppose the jack-connector 64M accurately. Hence, the jack-connector64M is properly connected to the plug-connector 74M.

[0292] Also, when the motherboard 51-1 is moved in a direction indicatedby an arrow A and is connected to the first back panel 70M comprisingthe small panels 321, the guide pin 344 is inserted into the guidecylinder 341, and the guide cylinder 343 has the guide-pin part 340 ainserted therein. Subsequently, the small panel 321 is moved slightly inthe plane X-Z so that the plug-connector 72M oppose the jack-connector55M accurately. Hence, the jack-connector 55M is properly connected tothe plug-connector 72M.

[0293] Therefore, the small panel 321 does not have to be positionedprecisely in the frame 320, facilitating an assembly of the first backpanel 70M. In the same manner, the small panel 331 of the second backpanel 80M does not have to be positioned precisely in the frame 330,facilitating an assembly of the second back panel 80M.

[0294]FIG. 25 is an illustration of a structure of a first connectionpart 95M-1, which is a first variation of the above-mentioned firstconnection part 95M shown in FIG. 24. The plug-connector 72M on thesurface 321 a of the small panel 321 has a pair of guide pins 347 a. Theplug-connector 74M on the surface 321 b of the small panel 321 has apair of guide pins 348 a. The jack-connector 64M of the crossbar-board60-1 has a pair of guide cylinders 348 b. The jack-connector 55M of themotherboard 511 has a pair of guide cylinders 347 b. In connecting thecrossbar-board 60-1 to the first back panel 70M comprising the smallpanels 321, the guide cylinders 348 b have the guide pins 348 a insertedtherein, and then, the small panel 321 is moved slightly in the planeX-Z so that the jack-connector 64M is properly connected to theplug-connector 74M. Also, in connecting the motherboard 55-1 to thefirst back panel 70M comprising the small panels 321, the guidecylinders 347 b have the guide pins 347 a inserted therein, and then,the small panel 321 is moved slightly in the plane X-Z so that thejack-connector 55M is properly connected to the plug-connector 72M.

[0295]FIG. 26 is an illustration of a structure of a first connectionpart 95M-2, which is a second variation of the above-mentioned firstconnection part 95M shown in FIG. 24. The plug-connector 72M on thesurface 321 a of the small panel 321 has a pair of guide cylinders 350on the opposite surface 321 b. The plug-connector 74M on the surface 321b of the small panel 321 has a pair of guide cylinders 351 on theopposite surface 321 a. The jack-connector 64M of the crossbar-board60-1 has a pair of guide pins 352. The jack-connector 55M of themotherboard 51-1 has a pair of guide pins 353. The guide pins 352 and353 each have a length enough to pass through the small panel 321.

[0296] In connecting the crossbar-board 60-1 to the first back panel 70Mcomprising the small panels 321, the guide pins 352 are passed throughthe small panel 321 and are inserted into the guide cylinders 351 on theopposite surface, and then, the small panel 321 is moved slightly in theplane X-Z so that the jack-connector 64M is properly connected to theplug-connector 74M. Also, in connecting the motherboard 55-1 to thefirst back panel 70M comprising the small panels 321, the guide pins 353are passed through the small panel 321 and are inserted into the guidecylinders 350 on the opposite surface, and then, the small panel 321 ismoved slightly in the plane X-Z so that the jack-connector 55M isproperly connected to the plug-connector 72M.

[0297] 14. FOURTEENTH EMBODIMENT

[0298]FIG. 27 is an illustration of a multiprocessor 50N according to afourteenth embodiment of the present invention. The multiprocessor 50Nhas substantially the same structure as the multiprocessor 50M shown inFIG. 23. The multiprocessor 50N comprises: a flexible connector 360;adjacent small panels 321A and 321B connected to each other thereby; anda power-supply connector 361 mounted on an edge of the small panel 321Ain the direction X2. The small panels 321A and 321B have power-supplypatterns 362 a and 362 b formed thereon, respectively.

[0299] An electric power is inputted to the power-supply connector 361,and then is supplied via the power-supply patterns 362 a, the flexibleconnector 360 and the power-supply patterns 362 b to the motherboards 51and the crossbar-boards 60.

[0300] The above-mentioned multiprocessor 50N has a structure where anelectric power is supplied in the direction X2 to X1.

[0301] 15. FIFTEENTH EMBODIMENT

[0302]FIG. 28 is an illustration of a multiprocessor 50P according to afifteenth embodiment of the present invention. The multiprocessor 50P isan SMP (Symmetric Multiprocessor) of the crossbar-interconnect type. Themultiprocessor 50P comprises: two grid-like power-supply frames 370 and371; the two crossbar-boards 60-1 and 60-2; and the four motherboards51-1 to 51-4. Each of the power-supply frames 370 and 371 has:connectors 372 for the crossbar-boards 60-1 and 60-2; and connectors 373for the motherboards 51-1 and 51-2 or the motherboards 51-3 to 51-4.

[0303] The power-supply frames 370 and 371 oppose each other. Each ofthe two crossbar-boards 60-1 and 60-2 has connectors 375, and is placedhorizontally between the two power-supply frames 370 and 371 with theconnectors 375 connected to the connectors 372. Each of the motherboards51-1 and 51-2 has connectors 376, and is supported vertically by thepower-supply frame 370 with the connectors 376 connected to theconnectors 373. Each of the motherboards 51-3 and 51-4 also has theconnectors 376, and is supported vertically by the power-supply frame371 with the connectors 376 connected to the connectors 373. Each of themotherboards 51-1 and 51-2 is connected to the two crossbar-boards 60-1and 60-2 by flexible-cable connectors 378 each comprising a flexiblecable and connectors on both ends thereof. Each of the motherboards 51-3and 514 is connected to the two crossbar-boards 60-1 and 60-2 also byother flexible-cable connectors 378. The multiprocessor 50P.

[0304] In this multiprocessor 50P, all of signal wires in theflexible-cable connectors 378 between the crossbar-boards 60-1 and 60-2and the motherboards 51-1 and 51-4 have an equal length. Thus, theequal-length wiring of the crossbar-boards 60 is not impaired at all.Hence, the multiprocessor 50P is an optimal SMP.

[0305] Additionally, motor-driven fans 380 and 381 are arranged on bothsides of the multiprocessor 50P in the directions Y2 and Y1. The fan 380sends air in the multiprocessor 50P as indicated by arrows 382. The fan381 sends the air out of the multiprocessor 50P. Since themultiprocessor 50P has no back panels, the air moves even on thecrossbar-boards 60-1 and 60-2. Thereby, the multiprocessor 50P can beeffectively forced-air cooled.

[0306] 16. SIXTEENTH EMBODIMENT

[0307]FIG. 29 is an illustration of a multiprocessor 50Q according to asixteenth embodiment of the present invention. The multiprocessor 50Q isan SMP (Symmetric Multiprocessor) of the crossbar-interconnect type, andhas motherboards only on one side thereof. In FIG. 29, elementscorresponding to the elements in FIG. 2 are marked by the same referencecharacters as in FIG. 2.

[0308] The multiprocessor 50Q comprises: the eight crossbar-boards 60-1to 60-8; the first back panel 70 connected to the longitudinal sides 62a of the crossbar-boards 60-1 to 60-8; a second back panel 80Q placedopposite the first back panel 70 and connected to the longitudinal sides62 b of the crossbar-boards 60-1 to 60-8; and the eight motherboards51-1 to 51-8 connected to the first back panel 70.

[0309] The second back panel 80Q has no motherboards connected thereto.The second back panel 80Q has wiring patterns extending lengthwise andobliquely on a surface thereof. The second back panel 80Q has a solefunction to connect the crossbar-boards 60-1 to 60-8 to each other.

[0310] In a conventional multiprocessor that does not have the secondback panel 80Q, the crossbar-boards 60-1 to 60-8 are connected to eachother by the motherboards 51-1 to 51-8. Therefore, in a conventionalmultiprocessor, the motherboards 51 have a comparatively large number ofwiring patterns. However, the multiprocessor 50Q according to thepresent invention comprises the second back panel 80Q connecting thecrossbar-boards 60-1 to 60-8 to each other so that the motherboards 51have a smaller number of wiring patterns.

[0311] Though the second back panel 80Q has no motherboards connectedthereto, the above-mentioned structures and the variations thereofaccording to the other embodiments of the present invention areapplicable to the multiprocessor 50Q according to the presentembodiment.

[0312] 17. SEVENTEENTH EMBODIMENT

[0313]FIG. 30 is an illustration of a multiprocessor 50R according to aseventeenth embodiment of the present invention. The multiprocessor 50Rhas the same structure as the multiprocessor 50K shown in FIG. 19according to the eleventh embodiment, except that the multiprocessor 50Rdoes not comprise the second back panel 80K and the motherboards 51-9 to51-16.

[0314] The multiprocessor 50R comprises: the eight crossbar-boards 60-1to 60-8; the first back panel 70K; and the eight motherboards 51-1 to51-8. The first back panel 70K is formed by the strip panels 260-1 to260-8.

[0315] The multiprocessor 50R is an embodiment wherein the structure ofthe multiprocessor 50K comprising the back panels 70K and 80K formed bythe strip panels 260 shown in FIG. 19 is applied to a multiprocessorhaving a single back panel.

[0316] The above-mentioned structures shown in FIG. 8 to FIG. 28 arealso applicable to a multiprocessor having a single back panel.

[0317] Next, descriptions will be given of a plurality of methods ofassembling the crossbar board-back panel assembly 88 being the core ofthe multiprocessor 50 shown in FIG. 2. It is noted that the crossbarboard-back panel assembly 88 comprises the crossbar-boards 60, the firstback panel 70 and the second back panel 80.

[0318] 1. FIRST ASSEMBLING METHOD

[0319]FIG. 31A is a perspective view showing a first assembling methodof the crossbar board-back panel assembly 88. FIG. 31B is a side viewshowing the first assembling method of the crossbar board-back panelassembly 88. The first assembling method uses an assembling apparatus400 comprising a fixed stage 401 and a movable stage 402. First, thecrossbar-boards 60-1 to 60-5 are connected to the first back panel 70.Second, the first back panel 70 connected with the crossbar-boards 60-1to 60-5 is set and fixed to the fixed stage 401. Then, the second backpanel 80 is set to the movable stage 402 in the plane X-Z and issupported in opposition to the first back panel 70. Next, the secondback panel 80 together with the movable stage 402 is moved in adirection indicated by an arrow 403 closer to the first back panel 70 sothat the second back panel 80 is connected to the crossbar-boards 60-1to 60-5.

[0320] Noticeably, a frame 405 made of an elastic material is attachedto the second back panel 80. The second back panel 80 is surrounded bythe frame 405.

[0321] The second back panel 80 is supported to the movable stage 402 bythe frame 405. Therefore, the elastic frame 405 allows the second backpanel 80 to move a little on the movable stage 402 in the directionsX1-X2 and the directions Z1-Z2.

[0322] Hence, in the course of connecting the plug-connectors of thesecond back panel 80 to the jack-connectors of the crossbar-boards 60-1to 60-5, the second back panel 80 is moved properly in the plane X-Z soas to adjust positions of the plug-connectors and the jack-connectors.Thereby, the plug-connectors of the second back panel 80 are smoothlyand appropriately connected to the jack-connectors of thecrossbar-boards 60-1 to 60-5.

[0323] It should be noted that a weight of the second back panel 80 issupported by the movable stage 402 via the elastic frame 405. Therefore,the weight of the second back panel 80 is absorbed by the elastic frame405. This keeps the plug-connectors and the jack-connectors from beingdamaged by the weight of the second back panel 80.

[0324] 2. SECOND ASSEMBLING METHOD

[0325]FIG. 32A is a perspective view showing a second assembling methodof the crossbar board-back panel assembly 88. FIG. 32B is a side viewshowing the second assembling method of the crossbar board-back panelassembly 88. In the second assembling method, the second back panel 80is fixed to a float 410. The float 410 is in a shallow and wide tank 411containing a water 412. The second back panel 80 together with the float410 is moved in a direction indicated by an arrow 413 so that the secondback panel 80 is connected to the crossbar-boards 60-1 to 60-5.

[0326] In this course, the weight of the second back panel 80 is reducedto the extent of a buoyancy acting on the float 410. This allows thesecond back panel 80 to be moved properly in the directions X1-X2 andthe directions Z1-Z2 in adjusting positions of the plug-connectors ofthe second back panel 80 and the jack-connectors of the crossbar-boards60-1 to 60-5. Thereby, the plug-connectors of the second back panel 80are smoothly and appropriately connected to the jack-connectors of thecrossbar-boards 60-1 to 60-5.

[0327] The above-mentioned buoyancy may be replaced by an air pressure.

[0328] Next, descriptions will be given of variations of the crossbarboard-back panel assembly 88.

[0329] 1. FIRST VARIATION

[0330]FIG. 33 is an illustration of a crossbar board-back panel assembly88-1, which is a first variation of the above-mentioned crossbarboard-back panel assembly 88. As shown in FIG. 33, the crossbarboard-back panel assembly 88-1 comprises: a stage 420 for the followingelements; a shelf 419 containing the first back panel 70 and thecrossbar-boards 60-1 to 60-5 connected thereto; a driving-belt machine421; and the second back panel 80 attached thereon.

[0331] The driving-belt machine 421 comprises: a motor 422; and a belt423 driven thereby. The bottom edge of the second back panel 80 is fixedvertically on the belt 423.

[0332] The crossbar board-back panel assembly 88-1 is assembled by usinga driving force of the motor 422. That is, the driving-belt machine 421is started to operate so as to drive the belt 423. Thereby, the secondback panel 80 is moved in a direction indicated by an arrow Y1 so as tobe connected to the crossbar-boards 60-1 to 60-5. In this way, thecrossbar board-back panel assembly 88-1 is assembled.

[0333] In performing a maintenance of the multiprocessor, thedriving-belt machine 421 is started to operate so as to drive the belt423 in the reverse direction. Thereby, the second back panel 80 is movedin a direction indicated by an arrow Y2 so as to be disconnected fromthe crossbar-boards 60-1 to 60-5. Accordingly, the multiprocessor can bemaintained.

[0334] 2. SECOND VARIATION

[0335]FIG. 34 is an illustration of a crossbar board-back panel assembly88-2, which is a second variation of the above-mentioned crossbarboard-back panel assembly 88. As shown in FIG. 34, the crossbarboard-back panel assembly 88-2 comprises: a stage 430 for the followingelements; the shelf 419 containing the first back panel 70 and thecrossbar-boards 60-1 to 60-5 connected thereto; a driving dolly 431; andthe second back panel 80 attached thereon.

[0336] The driving dolly 431 comprises: a body 432; a motor 433 attachedon the bottom thereof; and wheels 434 driven thereby. The bottom edge ofthe second back panel 80 is fixed vertically on the body 432.

[0337] The crossbar board-back panel assembly 88-2 is assembled bydriving the driving-dolly 431, and moving the second back panel 80 in adirection indicated by an arrow Y1 so as to connect the second backpanel 80 to the crossbar-boards 60-1 to 60-5.

[0338] In performing a maintenance of the multiprocessor, the drivingdolly 431 is driven in the reverse direction. Thereby, the second backpanel 80 is moved in a direction indicated by an arrow Y2 so as to bedisconnected from the crossbar-boards 60-1 to 60-5. Accordingly, themultiprocessor can be maintained.

[0339] 3. THIRD VARIATION

[0340]FIG. 35A is an illustration of a crossbar board-back panelassembly 88-3, which is a third variation of the above-mentionedcrossbar board-back panel assembly 88. As shown in FIG. 35A, thecrossbar board-back panel assembly 88-3 comprises: a stage 441 withcasters 440 attached on the bottom thereof; and the shelf 419 containingthe first back panel 70 and the second back panel 80 each connected tothe crossbar-boards 60-1 to 60-5.

[0341]FIG. 35B is an illustration of a server 450 including a room 453to contain the crossbar board-back panel assembly 88-3 shown in FIG.35A. As shown in FIG. 35B, the server 450 comprises two separate bodies451 and 452. The body 451 has the room 453 at a lower part thereof toaccommodate the crossbar board-back panel assembly 88-3.

[0342]FIG. 35C is an illustration of the server 450 containing thecrossbar board-back panel assembly 88-3 in the room 453. The crossbarboard-back panel assembly 88-3 shown in FIG. 35A is capable of moving onthe rolling casters 440 thereof so that, as shown in FIG. 35C, thecrossbar board-back panel assembly 88-3 is contained and fixed in theroom 453. Then, the motherboards 51 are plugged in and connected to thecrossbar board-back panel assembly 88-3, composing the multiprocessor50.

[0343] In performing a maintenance of the multiprocessor 50, the body451 is moved so that the motherboards 51 can be pulled out. Then, thecrossbar board-back panel assembly 88-3 is moved on the rolling casters440 so that the crossbar board-back panel assembly 88-3 is taken out ofthe room 453.

[0344] The crossbar board-back panel assembly 88-3 is removed from theserver 450 efficiently by using the casters 440. Also, after amaintenance, the crossbar board-back panel assembly 88-3 is moved to andcontained in the server 450 efficiently by using the casters 440.

[0345] 4. FOURTH VARIATION

[0346]FIG. 36A is an illustration of the crossbar-board 60 beingconnected to the first back panel 70, of a crossbar board-back panelassembly 88-4, which is a fourth variation of the above-mentionedcrossbar board-back panel assembly 88. FIG. 36B is a cross-sectionalview of a connection pin 460 shown in FIG. 36A before being insertedinto a connection block 461. FIG. 36C is a cross-sectional view of theconnection pin 460 shown in FIG. 36A inserted into the connection block461. FIG. 36D is a cross-sectional view of the connection pin 460 shownin FIG. 36A bending upward in the connection block 461. As shown in FIG.36A, the crossbar board 60 comprises the connection pin 460 fixed on thesurface thereof and partly protruding in the direction Y2. Theconnection pin 460 is made of a shape memory alloy so that one end ofthe protruding part of the connection pin 460 bends upward in thedirection Z1 at a temperature T1 ° C. raised by the multiprocessor inoperation. The connection pin 460 is straight at a normal temperature.When the temperature is raised to T1 ° C., a part 462 of the connectionpin 460 bends upward in the direction Z1, as shown in FIG. 36D. Thefirst back panel 70 comprises a connection block 461 fixed at a positionof the surface thereof corresponding to the connection pin 460. As shownin FIG. 36B, the connection block 461 comprises: a hole 461 a into whichthe connection pin 460 is inserted; and a hooked hole 461 bperpendicular to the hole 461 a.

[0347] The crossbar board-back panel assembly 88-4 is assembled byconnecting the crossbar board 60 and the first back panel 70 with thejack-connector 64 connected to the plug-connector 74, and the connectionpin 460 inserted into the hole 461 a of the connection block 461 asshown in FIG. 36C.

[0348] Thereafter, when the multiprocessor is initially brought intooperation and then the temperature is raised to T1 ° C., the part 462 ofthe connection pin 460 bends upward and hooks in the hooked hole 461 b,as shown in FIG. 36D. After this, the connection pin 460 maintains thisshape, firming the connection between the crossbar board 60 and thefirst back panel 70.

[0349] 5. FIFTH VARIATION

[0350]FIG. 37 is an illustration of a crossbar board-back panel assembly88-5, which is a fifth variation of the above-mentioned crossbarboard-back panel assembly 88. The crossbar board-back panel assembly88-5 comprises: the shelf 419; the first back panel 70 attached to aside thereof in the direction Y2; the crossbar-boards 60-1 to 60-5connected to the first back panel 70 in the shelf 419; and the secondback panel 80 attached to a side of the shelf 419 in the direction Y1and connected to the crossbar-boards 60-1 to 60-5.

[0351] The second back panel 80 is attached to the shelf 419 alreadyattached with the first back panel 70 connected with the crossbar-boards60, as a final step of manufacturing the crossbar board-back panelassembly 88-5.

[0352] The shelf 419 comprises light-emitters 470 on the four corners ofthe side thereof in the direction Y1. The second back panel 80 compriseslight-receivers 471 on the four corners of the surface thereof in thedirection Y2. In the course of attaching the second back panel 80 to theshelf 419, the second back panel 80 is adjusted in position so that thelight-receivers 471 of the second back panel 80 equally receive lightsemitted by the light-emitters 470 of the shelf 419. Thus, the secondback panel 80 is smoothly connected to the crossbar-boards 60-1 to 60-5.

[0353] 6. SIXTH VARIATION

[0354]FIG. 38 is an illustration of a connection part of thecrossbar-board 60 and the first back panel 70, of a crossbar board-backpanel assembly 88-6, which is a sixth variation of the above-mentionedcrossbar board-back panel assembly 88. The crossbar-board 60 comprises apin 480 partly projecting from an edge thereof in the direction Y2 by apredetermined length L10. The first back panel 70 comprises a throughhole 481 at a position corresponding to the pin 480.

[0355] The crossbar-board 60 is connected to the first back panel 70 bypushing the crossbar-board 60 in the direction Y2 so that thejack-connector 64 of the crossbar-board 60 is connected to theplug-connector 74 of the first back panel 70. Herewith, the pin 480protrudes to the surface of the first back panel 70 in the direction Y2through the through hole 481.

[0356] The jack-connector 64 and the plug-connector 74 cannot be seenfrom outside, because the jack-connector 64 and the plug-connector 74are at the back side of the first back panel 70. Thus, it is hard todirectly confirm by eye that the jack-connector 64 is properly connectedto the plug-connector 74. However, judging from a length L11 of the pin480 protruding from the first back panel 70, one can confirm indirectlythat the jack-connector 64 is properly connected to the plug-connector74. The pin 480 may be marked with scales to facilitate theconfirmation.

[0357] Additionally, when the pin 480 is being inserted into the throughhole 481, the pin 480 has a function to guide the jack-connector 64 tothe plug-connector 74.

[0358] 7. SEVENTH VARIATION

[0359]FIG. 39 is an illustration of a connection part of thecrossbar-board 60 and the first back panel 70, of a crossbar board-backpanel assembly 88-7, which is a seventh variation of the above-mentionedcrossbar board-back panel assembly 88. The crossbar board-back panelassembly 88-7 is also a variation of the above-mentioned crossbarboard-back panel assembly 88-6 shown in FIG. 38 as the sixth variation.

[0360] The crossbar-board 60 comprises a pin 490 arranged upright at apredetermined position on the surface thereof. The shelf 419 comprises ascale board 491 arranged perpendicular to the surface of the first backpanel 70.

[0361] When the crossbar-board 60 is connected to the first back panel70, the connection of the jack-connector 64 to the plug-connector 74 canbe confirmed indirectly by judging from a position of the pin 490 on thescale board 491.

[0362] 8. EIGHTH VARIATION

[0363]FIG. 40 is an illustration of a crossbar board-back panel assembly88-8, which is an eighth variation of the above-mentioned crossbarboard-back panel assembly 88. The crossbar board-back panel assembly88-8 comprises: the first back panel 70; the crossbar-boards 60-1 to60-5 connected thereto; and the second back panel 80 connected to thecrossbar-boards 60-1 to 60-5.

[0364] The second back panel 80 comprises a plurality of load cells 500dispersed in a matrix on the whole surface of the second back panel 80.Each of the load cells 500 detects a resistance that acts thereon whenthe second back panel 80 is connected to the crossbar-boards 60-1 to60-5. Each of the load cells 500 is connected to a load-controllingdevice 510.

[0365] A pressurizing device 520 comprises a plurality of hydraulicpushers 521. These hydraulic pushers 521 of the pressurizing device 520are individually under control of the load-controlling device 510.

[0366] When the crossbar board-back panel assembly 88-8 is assembled,the plurality of hydraulic pushers 521 push a plurality of parts of thesecond back panel 80 so that the second back panel 80 is connected tothe crossbar-boards 60-1 to 60-5. The load-controlling device 510controls the pressurizing device 520 to operate so that the hydraulicpushers 521 pushing the parts near the load cells 500 detecting a highresistance (the central parts of the second back panel 80, for example)provide more pressure than the other hydraulic pushers 521. Thereby, allof the plug-connectors 84 of the second back panel 80 are properlyconnected to the jack-connectors 64 of the crossbar-boards 60-1 to 60-5.

[0367] It is noted that the hydraulic pushers 521 may be replaced bypneumatic pushers.

[0368] 9. NINTH VARIATION

[0369]FIG. 41 is an illustration of a crossbar board-back panel assembly88-9, which is a ninth variation of the above-mentioned crossbarboard-back panel assembly 88. The crossbar board-back panel assembly88-9 comprises: the first back panel 70; the crossbar-boards 60-1 to60-3 connected thereto; and the second back panel 80 connected to thecrossbar-boards 60-1 to 60-3.

[0370] Each of the crossbar-boards 60-1 to 60-3 comprises aligningconnectors 530 on the upper and under surfaces thereof near both edgesin the longitudinal directions. A crossbar-board assembly 540 iscomposed of the crossbar-boards 60-1 to 60-3 with the aligningconnectors 530 thereof being placed on and connected to each other.Thus, the crossbar-boards 60-1 to 60-3 are connected to each other bythe aligning connectors 530 near both edges in the longitudinaldirections so as to be placed accurately to each other with apredetermined distance in between in the direction Z1-Z2.

[0371] The crossbar board-back panel assembly 88-9, in other words,comprises: the crossbar-board assembly 540; and the first back panel 70and the second back panel 80 respectively connected to both sidesthereof.

[0372] The crossbar-board assembly 540 also has the jack-connectors 64and the jack-connectors 65 arranged with precision. Therefore, when thefirst back panel 70 is connected to the crossbar-board assembly 540, theplug-connectors 74 of the first back panel 70 are connected to thejack-connectors 64 smoothly. Likewise, when the second back panel 70 isconnected to the crossbar-board assembly 540, the plug-connectors 84 ofthe second back panel 80 are connected to the jack-connectors 65smoothly.

[0373] The present invention is not limited to the specificallydisclosed embodiments, and variations and modifications may be madewithout departing from the scope of the present invention.

[0374] The present application is based on Japanese priority applicationNo. 2000-246007 filed on Aug. 14, 2000, the entire contents of which arehereby incorporated by reference.

What is claimed is:
 1. An information-processing device comprising: atleast one crossbar-board having a switching element mounted thereon; aplurality of back panels detachably connected electrically andmechanically to different sides of said crossbar-board; and at least onemotherboard detachably connected electrically and mechanically to eachof said back panels, the motherboard having an information-processingsemiconductor element mounted thereon.
 2. An information-processingdevice comprising: a crossbar board-back panel assembly comprising aplurality of crossbar-boards each having a switching element mountedthereon, and a plurality of back panels detachably connectedelectrically and mechanically to different sides of each of saidcrossbar-boards; and a plurality of motherboards detachably connectedelectrically and mechanically to each of said back panels, each of theplurality of the motherboards having an information-processingsemiconductor element mounted thereon.
 3. The information-processingdevice as claimed in claim 1, wherein said crossbar-board is arrangedperpendicular to a surface of each of said back panels.
 4. Theinformation-processing device as claimed in claim 1, wherein saidmotherboard is arranged crosswise to said crossbar-board.
 5. Theinformation-processing device as claimed in claim 1, wherein said backpanels are connected to the different sides of said crossbar-board byconnectors.
 6. The information-processing device as claimed in claim 1,wherein said motherboard is connected to each of said back panels byconnectors.
 7. The information-processing device as claimed in claim 5,wherein said crossbar-board further comprises wiring patterns connectingsaid switching element and said connectors, the wiring patterns beingformed to have an equal length.
 8. The information-processing device asclaimed in claim 1, wherein said crossbar-board has a rectangular shape,and said back panels are connected to longitudinal sides of saidcrossbar-board, the plurality of the back panels opposing each other. 9.The information-processing device as claimed in claim 8, wherein saidcrossbar-board further comprises connectors connecting the longitudinalsides of said crossbar-board to said back panels, each of the connectorshaving a connecting face parallel to a surface of said crossbar-board,and said back panels further comprise connectors respectively connectingsaid back panels to the longitudinal sides of said crossbar-board, eachof the connectors having a connecting face perpendicular to a surface ofeach of said back panels, wherein said crossbar-board is movable in adirection perpendicular to the surface thereof so as to connect saidconnectors thereof to said connectors of said back panels.
 10. Theinformation-processing device as claimed in claim 8, wherein saidcrossbar-board further comprises at least one extension crossbar-boardconnected at an end of said crossbar-board in a longitudinal direction.11. The information-processing device as claimed in claim 1, whereinsaid crossbar-board has a polygonal shape, and the plurality of the backpanels are connected to the different sides of said crossbar-board, theplurality of the back panels being more than two.
 12. Theinformation-processing device as claimed in claim 2, wherein each ofsaid back panels is formed by a plurality of strip panels arranged atpositions corresponding to said motherboards, the plurality of the strippanels crossing said crossbar-boards.
 13. The information-processingdevice as claimed in claim 2, wherein each of said back panels is formedby a plurality of strip panels arranged at positions corresponding tosaid crossbar-boards, said motherboards crossing the plurality of thestrip panels.
 14. A method of manufacturing a crossbar board-back panelassembly of an information-processing device comprising: the crossbarboard-back panel assembly comprising a plurality of crossbar-boardsarranged in parallel, and a plurality of back panels detachablyconnected electrically and mechanically to different sides of each ofsaid crossbar-boards; and a plurality of motherboards detachablyconnected electrically and mechanically to each of said back panels,each of the plurality of the motherboards having aninformation-processing semiconductor element mounted thereon, the methodcomprising the steps of: holding each of said back panels while allowingthe held back panel to move slightly in directions parallel to a surfacethereof; and pressing the held back panel to one of the different sidesof each of said crossbar-boards so that the held back panel is connectedto the one of the different sides of each of said crossbar-boards. 15.The information-processing device as claimed in claim 13, wherein saidstrip panels are supplied with different voltages.
 16. Aninformation-processing device comprising: a crossbar board-back panelassembly comprising a plurality of rectangular crossbar-boards arrangedin parallel, and two opposing back panels detachably connectedelectrically and mechanically to longitudinal sides of each of saidcrossbar-boards; and a plurality of motherboards detachably connectedelectrically and mechanically to each of said two opposing back panels,each of the plurality of the motherboards having aninformation-processing semiconductor element mounted thereon, whereinsaid two opposing back panels are formed by a plurality of pairs of twoopposing strip panels arranged at positions corresponding to each ofsaid rectangular crossbar-boards, and said crossbar board-back panelassembly includes a plurality of crossbar board-strip panel assembliespiled up on each other, each of said crossbar board-strip panelassemblies comprising one of said rectangular crossbar-boards, and oneof said pairs of said two opposing strip panels detachably connectedelectrically and mechanically to the longitudinal sides of the one ofsaid rectangular crossbar-boards.
 17. The information-processing deviceas claimed in claim 16, wherein said crossbar board-back panel assemblyfurther comprises a guide pole arranged upright so that said crossbarboard-strip panel assemblies are piled up on each other with a holeformed in each of said rectangular crossbar-boards being passed throughby said guide pole, and said crossbar board-strip panel assemblies aresupplied with a voltage via said guide poles.
 18. Theinformation-processing device as claimed in claim 16, wherein saidcrossbar board-back panel assembly further comprises guide railsarranged horizontally so that said crossbar board-strip panel assembliesare piled up on each other with upper and under edges of each of saidpairs of said two opposing strip panels being inserted into said guiderails, and said crossbar board-strip panel assemblies are supplied witha voltage via said guide rails.
 19. The information-processing device asclaimed in claim 2, further comprising hollow heat-radiation componentseach placed between said crossbar-boards, wherein an air moves throughinside of said hollow heat-radiation components.
 20. Theinformation-processing device as claimed in claim 1, wherein each ofsaid back panels comprises a grid-like frame and smaller panels thaneach of said back panels, the smaller panels arranged in the grid-likeframe.
 21. The information-processing device as claimed in claim 20,wherein said smaller panels are supplied with a voltage via saidgrid-like frame.
 22. The information-processing device as claimed inclaim 1, wherein each of said back panels comprises smaller panels thaneach of said back panels, the smaller panels detachably connectedelectrically and mechanically to each other.
 23. Aninformation-processing device comprising: two grid-like frames opposingeach other; a plurality of crossbar-boards fixed between said twogrid-like frames; at least one motherboard fixed to each of said twogrid-like frames, the motherboard having an information-processingsemiconductor element mounted thereon; and a flexible connectorconnecting said motherboard and each of said crossbar-boards.
 24. Aninformation-processing device comprising: a crossbar board-back panelassembly comprising a plurality of crossbar-boards arranged in parallel,and a plurality of back panels detachably connected electrically andmechanically to different sides of each of said crossbar-boards; and aplurality of motherboards detachably connected electrically andmechanically to each of said back panels, each of the plurality of themotherboards having an information-processing semiconductor elementmounted thereon, wherein said crossbar board-back panel assemblyincludes a caster provided on the bottom thereof.
 25. A servercomprising: a body having a room to contain a crossbar board-back panelassembly comprising a plurality of crossbar-boards arranged in parallel,and a plurality of back panels detachably connected electrically andmechanically to different sides of each of said crossbar-boards; and thecrossbar board-back panel assembly including a caster provided on thebottom thereof, the crossbar board-back panel assembly being containedin said room.